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TDA8002BT/3/C2-T PDF预览

TDA8002BT/3/C2-T

更新时间: 2024-01-04 21:23:15
品牌 Logo 应用领域
恩智浦 - NXP 光电二极管外围集成电路
页数 文件大小 规格书
28页 131K
描述
IC SPECIALTY MICROPROCESSOR CIRCUIT, PDSO28, Microprocessor IC:Other

TDA8002BT/3/C2-T 技术参数

生命周期:Obsolete包装说明:SOP,
Reach Compliance Code:unknownHTS代码:8542.31.00.01
风险等级:5.6JESD-30 代码:R-PDSO-G28
长度:17.9 mm端子数量:28
最高工作温度:85 °C最低工作温度:-25 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
认证状态:Not Qualified座面最大高度:2.65 mm
最大供电电压:6.5 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL宽度:7.5 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUITBase Number Matches:1

TDA8002BT/3/C2-T 数据手册

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© Philips Electronics N.V. 1997  
SCA55  
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Printed in The Netherlands  
547047/1200/03/pp28  
Date of release: 1997 Nov 04  
Document order number: 9397 750 02454  

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