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TCA4027036AA015000-FREQ PDF预览

TCA4027036AA015000-FREQ

更新时间: 2024-11-21 16:49:39
品牌 Logo 应用领域
PLETRONICS 机械振荡器
页数 文件大小 规格书
6页 87K
描述
Clipped Sine Output Oscillator, 10MHz Min, 40MHz Max, ROHS COMPLIANT, CERAMIC, LCC-4

TCA4027036AA015000-FREQ 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Not RecommendedReach Compliance Code:compliant
风险等级:5.63Is Samacsys:N
其他特性:TAPE AND REEL老化:1 PPM/YEAR
频率调整-机械:NO频率稳定性:1.5%
JESD-609代码:e4安装特点:SURFACE MOUNT
最大工作频率:40 MHz最小工作频率:10 MHz
最高工作温度:40 °C最低工作温度:10 °C
振荡器类型:CLIPPED SINE输出阻抗:10000 Ω
输出电平:0.8 V物理尺寸:7.0mm x 5.0mm x 1.88mm
最大供电电压:3.6 V最小供电电压:2.7 V
表面贴装:YES端子面层:Gold (Au) - with Nickel (Ni) barrier
Base Number Matches:1

TCA4027036AA015000-FREQ 数据手册

 浏览型号TCA4027036AA015000-FREQ的Datasheet PDF文件第2页浏览型号TCA4027036AA015000-FREQ的Datasheet PDF文件第3页浏览型号TCA4027036AA015000-FREQ的Datasheet PDF文件第4页浏览型号TCA4027036AA015000-FREQ的Datasheet PDF文件第5页浏览型号TCA4027036AA015000-FREQ的Datasheet PDF文件第6页 
TCA4 Series  
TCXO / TCVCXO  
November 2010  
• Pletronics’ TCA4 Series is a temperature  
compensated crystal oscillator with an optional  
voltage control function and a clipped sinewave  
output.  
• 10 to 40 MHz  
• 5 x 7 mm LCC Ceramic Package  
• Optional Voltage Control Function (TCVCXO)  
• The package is designed for high density  
surface mount designs.  
• Tape and Reel packaging is available.  
Pletronics Inc. certifies this device is in accordance with the  
RoHS (2002/95/EC) and WEEE (2002/96/EC) directives.  
Pletronics Inc. guarantees the device does not contain the following:  
Cadmium, Hexavalent Chromium, Lead, Mercury, PBB’s, PBDE’s  
Weight of the Device: 0.17 grams  
Moisture Sensitivity Level: 1 As defined in J-STD-020D.1  
Second Level Interconnect code: e4  
Absolute Maximum Ratings:  
Parameter  
Unit  
VCC Supply Voltage  
Vi Input Voltage  
Vo Output Voltage  
-0.5V to +6.5V  
-0.5V to VCC + 0.5V  
-0.5V to VCC + 0.5V  
Reliability: Environmental Compliance  
Parameter  
Condition  
Mechanical Shock  
Vibration  
MIL-STD-883 Method 2002, Condition A  
MIL-STD-883 Method 2007, Condition A  
MIL-STD-883 Method 2003  
Solderability  
Thermal Shock  
MIL-STD-883 Method 1011, Condition A  
Thermal Characteristics  
The maximum die or junction temperature is 155oC  
The thermal resistance junction to board is 30 to 50oC/Watt depending on the solder pads, ground plane  
and construction of the PCB.  
Product informatin is current as of publication date. The product conforms  
to specifications per the terms of the Pletronics standard warranty. Production  
processsing does not necesarily include testing of all parameters.  
Copyright © 2010, Pletronics Inc.  

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