P-Channel Enhancement Mode MOSFET
TBL150P06D
Electrical Characteristics (@ TC = 25°C unless otherwise specified)
Symbol
Parameter
Test Condition
Min. Typ. Max. Unit
Static Characteristics
VDSS
IDSS
IGSS
Drain-Source Breakdown Voltage
VGS = 0V, ID = -250μA
VDS = -60V, VGS = 0V
VGS = ±20V, VDS = 0V
-60
-
-
-
-
V
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
-
-
-1
μA
nA
±1 00
On Characteristics *2
VGS = -10V,ID = -20A
VGS = -4.5V,ID = -20A
VDS = VGS, ID = -250 μA
VGS = 0V, f = 1MHz
-
-
11
13
15
18
-2.5
-
mΩ
mΩ
V
RDS(ON)
Static Drain-Source On-resistance
VGS(th)
RG
Gate Threshold Voltage
Gate Resistance
-1
-
-1.7
3.2
Ω
Dynamic Characteristics
gfs
Forward Transconductance
VDS = -5V, ID = -20A
-
-
-
-
25
5007
337
246
-
-
-
-
S
CISS
COSS
CRSS
Input Capacitance
VGS = 0V
Output Capacitance
VDS = -30V
f = 1.0MHz
pF
Reverse Transfer Capacitance
Switching Characteristics
td(ON)
tr
td(OFF)
tf
Turn-on Delay Time *3
Turn-on Rise Time *3
Turn-Off Delay Time *3
Turn-Off Fall Time *3
Total Gate-Charge
-
-
-
-
-
-
-
18
20
-
-
-
-
-
-
-
VDD =-30V
VGS = -10V
RG = 3Ω
ns
55
RL = 1.5Ω
35
QG
93
VDD = -30V
VGS = -10V
ID = -20A
QGS
QGD
Gate to Source Charge
Gate to Drain (Miller) Charge
15.7
15.8
nC
Source-Drain Diode Characteristics
VSD
trr
Diode Forward Voltage *2
Reverse Recovery Time
Reverse Recovery Charge
ISD = -20A, VGS = 0V, TJ = 25°C
-
-
-
-0.8
40
-1.2
V
-
-
ns
nC
IF = -20A, VGS = 0V
dIF/dt = 100A/us
Qrr
35
Notes:
1. Surface mounted on 1 inch2 FR-4 board with 2OZ copper
2. The data tested by pulsed, pulse width ≤ 300μs, duty cycle ≤ 2%
3. Guaranteed by design, not subject to production
4. EAS condition: TJ = 25°C , VDD = -30V, VGS = -10V, L = 0.5mH, RG = 25Ω
MTM1008A: December 2022 [2.0]
www.gmesemi.com
2