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TA31136FN-TP1 PDF预览

TA31136FN-TP1

更新时间: 2024-11-27 19:00:35
品牌 Logo 应用领域
东芝 - TOSHIBA 无绳技术电信光电二极管电信集成电路
页数 文件大小 规格书
14页 344K
描述
IC TELECOM, CORDLESS, RF AND BASEBAND CIRCUIT, PDSO16, 0.225 INCH, PLASTIC, SSOP-16, Cordless Telephone IC

TA31136FN-TP1 技术参数

生命周期:Active零件包装代码:SOIC
包装说明:LSSOP,针数:16
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.03JESD-30 代码:R-PDSO-G16
长度:5 mm端子数量:16
最高工作温度:85 °C最低工作温度:-30 °C
封装主体材料:PLASTIC/EPOXY封装代码:LSSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
认证状态:Not Qualified座面最大高度:1.6 mm
表面贴装:YES电信集成电路类型:CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
温度等级:OTHER端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
宽度:4.4 mmBase Number Matches:1

TA31136FN-TP1 数据手册

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