Contents
1
Introduction..............................................................................................................7
1.1
1.2
Terminology .......................................................................................................9
References .........................................................................................................9
2
Low Power Features................................................................................................ 11
2.1
Clock Control and Low Power States .................................................................... 11
2.1.1 Core Low-Power States ........................................................................... 13
2.1.1.1 C0 State.................................................................................. 13
2.1.1.2 C1/AutoHALT Powerdown State .................................................. 13
2.1.1.3 C1/MWAIT Powerdown State ...................................................... 13
2.1.1.4 Core C2 State........................................................................... 13
2.1.1.5 Core C3 State........................................................................... 14
2.1.1.6 Core C4 State........................................................................... 14
2.1.2 Package Low Power States ...................................................................... 14
2.1.2.1 Normal State............................................................................ 14
2.1.2.2 Stop-Grant State ...................................................................... 14
2.1.2.3 Stop Grant Snoop State............................................................. 15
2.1.2.4 Sleep State.............................................................................. 15
2.1.2.5 Deep Sleep State...................................................................... 16
2.1.2.6 Deeper Sleep State................................................................... 16
Enhanced Intel SpeedStep® Technology .............................................................. 17
Extended Low Power States................................................................................ 18
FSB Low Power Enhancements............................................................................ 19
Processor Power Status Indicator (PSI#) Signal..................................................... 19
2.2
2.3
2.4
2.5
3
Electrical Specifications........................................................................................... 21
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
Power and Ground Pins ...................................................................................... 21
FSB Clock (BCLK[1:0]) and Processor Clocking...................................................... 21
Voltage Identification......................................................................................... 21
Catastrophic Thermal Protection.......................................................................... 24
Signal Terminations and Unused Pins................................................................... 25
FSB Frequency Select Signals (BSEL[2:0])............................................................ 25
FSB Signal Groups............................................................................................. 25
CMOS Signals ................................................................................................... 27
Maximum Ratings.............................................................................................. 27
3.10 Processor DC Specifications ................................................................................ 28
4
5
Package Mechanical Specifications and Pin Information.......................................... 41
4.1
Package Mechanical Specifications....................................................................... 41
4.1.1 Package Mechanical Drawings .................................................................. 41
4.1.2 Processor Component Keep-Out Zones...................................................... 46
4.1.3 Package Loading Specifications ................................................................ 46
4.1.4 Processor Mass Specifications .................................................................. 46
Processor Pinout and Pin List .............................................................................. 47
Alphabetical Signals Reference............................................................................ 49
4.2
4.3
Thermal Specifications and Design Considerations .................................................. 79
5.1
Thermal Specifications ....................................................................................... 85
5.1.1 Thermal Diode ....................................................................................... 85
5.1.2 Thermal Diode Offset.............................................................................. 87
5.1.3 Intel® Thermal Monitor........................................................................... 87
5.1.4 Digital Thermal Sensor (DTS)................................................................... 89
5.1.5 Out of Specification Detection .................................................................. 90
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