T2322B
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
3.5
60
Unit
°C/W
°C/W
°C
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient
R
q
JC
JA
L
R
q
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Sec
T
260
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted; Electricals apply in both directions)
C
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Peak Repetitive Blocking Current
I
I
DRM,
RRM
(V = Rated V , V Gate Open)
T = 25°C
J
−
−
−
0.2
10
0.75
mA
mA
D
DRM
RRM;
J
T = 110°C
ON CHARACTERISTICS
Peak On-State Voltage (Note 3)
V
−
−
1.7
−
2.2
10
V
TM
(I = "10 A)
TM
Gate Trigger Current (Continuous dc)
I
mA
GT
(V = 12 V, R = 100 W)
D
L
All Quadrants
Gate Trigger Voltage (Continuous dc)
V
−
0.15
−
1.0
−
2.2
−
V
V
GT
(V = 12 Vdc, R = 100 W, T = 25°C)
D
L
C
Gate Non−Trigger Voltage
V
GD
(V = 12 V, R = 100 W, T = 110°C)
D
L
C
Holding Current
I
15
1.8
30
2.5
mA
ms
H
(V = 12 V, I (Initiating Current) = "200 mA, Gate Open)
D
T
Gate Controlled Turn-On Time
t
−
gt
(V = Rated V
, I = 10 A pk, I = 60 mA, tr = 0.1 msec)
D
DRM TM
G
DYNAMIC CHARACTERISTICS
Critical Rate-of-Rise of Off-State Voltage
(V = Rated V , Exponential Waveform, T = 100°C)
dv/dt
10
100
4.0
−
−
V/ms
V/ms
D
DRM
C
Critical Rate-of-Rise of Commutation Voltage
(V = Rated V , I = 3.5 A pk, Commutating
dv/dt(c)
1.0
D
DRM TM
di/dt = 1.26 A/ms, Gate Unenergized, T = 90°C)
C
3. Pulse Test: Pulse Width ≤ 1.0 ms, Duty Cycle ≤ 2%.
http://onsemi.com
2