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SZMMBZ5230BLT3G PDF预览

SZMMBZ5230BLT3G

更新时间： 2024-11-28 14:45:03
品牌 Logo 应用领域
安森美 - ONSEMI 二极管
页数 文件大小 规格书
6页 165K
描述
DIODE VOLTAGE REGULATOR DIODE, Voltage Regulator Diode

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中文翻译

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SZMMBZ5230BLT3G 技术参数

是否Rohs认证： 符合生命周期：Active
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8541.10.00.50风险等级：5.78
二极管类型：ZENER DIODE峰值回流温度（摄氏度）：NOT SPECIFIED
处于峰值回流温度下的最长时间：NOT SPECIFIEDBase Number Matches：1

SZMMBZ5230BLT3G 数据手册

 浏览型号SZMMBZ5230BLT3G的Datasheet PDF文件第2页浏览型号SZMMBZ5230BLT3G的Datasheet PDF文件第3页浏览型号SZMMBZ5230BLT3G的Datasheet PDF文件第4页浏览型号SZMMBZ5230BLT3G的Datasheet PDF文件第5页浏览型号SZMMBZ5230BLT3G的Datasheet PDF文件第6页 
MMBZ52xxBLT1 Series,  
SZMMBZ52xxBLT1G Series  
Zener Voltage Regulators  
225 mW SOT−23 Surface Mount  
This series of Zener diodes is offered in the convenient, surface  
mount plastic SOT−23 package. These devices are designed to provide  
voltage regulation with minimum space requirement. They are well  
suited for applications such as cellular phones, hand held portables,  
and high density PC boards.  
http://onsemi.com  
3
1
Cathode  
Anode  
Features  
• 225 mW Rating on FR−4 or FR−5 Board  
• Zener Voltage Range − 2.4 V to 91 V  
• Package Designed for Optimal Automated Board Assembly  
• Small Package Size for High Density Applications  
• ESD Rating of Class 3 (>16 KV) per Human Body Model  
• AEC−Q101 Qualified and PPAP Capable  
• SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
MARKING  
DIAGRAM  
3
SOT−23  
CASE 318  
STYLE 8  
xxx  
G
G
1
2
• Pb−Free Packages are Available  
Mechanical Characteristics  
xxx  
M
= Specific Device Code  
= Date Code  
= Pb−Free Package  
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
G
(Note: Microdot may be in either location)  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
ORDERING INFORMATION  
†
Device  
Package  
Shipping  
MMBZ52xxBLT1  
SOT−23 3000/Tape & Reel  
MAXIMUM RATINGS  
MMBZ52xxBLT1G  
SOT−23 3000/Tape & Reel  
(Pb−Free)  
Rating  
Symbol  
Max  
Unit  
Total Power Dissipation on FR−5 Board,  
P
D
SZMMBZ52xxBLT1G SOT−23 3000/Tape & Reel  
(Pb−Free)  
(Note 1) @ T = 25°C  
225  
1.8  
mW  
mW/°C  
A
Derated above 25°C  
MMBZ52xxBLT3  
SOT−23  
10,000/Tape &  
Reel  
Thermal Resistance,  
Junction−to−Ambient  
R
556  
°C/W  
q
JA  
MMBZ52xxBLT3G  
SOT−23  
(Pb−Free)  
10,000/Tape &  
Reel  
Total Power Dissipation on Alumina  
P
D
Substrate, (Note 2) @ T = 25°C  
300  
2.4  
mW  
mW/°C  
A
Derated above 25°C  
SZMMBZ52xxBLT3G SOT−23  
(Pb−Free)  
10,000/Tape &  
Reel  
Thermal Resistance,  
R
417  
°C/W  
q
JA  
Junction−to−Ambient  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Junction and Storage  
Temperature Range  
T , T  
−65 to +150  
°C  
J
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR−5 = 1.0 X 0.75 X 0.62 in.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
2. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
November, 2011 − Rev. 10  
MMBZ5221BLT1/D  
 
123456

中文翻译

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