1SMC5.0AT3G Series,
SZ1SMC5.0AT3G Series
1500 Watt Peak Power
Zener Transient Voltage
Suppressors
http://onsemi.com
Unidirectional*
PLASTIC SURFACE MOUNT
ZENER TRANSIENT
VOLTAGE SUPPRESSORS
5.0−78 VOLTS
1500 WATT PEAK POWER
The SMC series is designed to protect voltage sensitive
components from high voltage, high energy transients. They have
excellent clamping capability, high surge capability, low zener
impedance and fast response time. The SMC series is supplied in
ON Semiconductor’s exclusive, cost-effective, highly reliable
SURMETIC package and is ideally suited for use in
communication systems, automotive, numerical controls, process
controls, medical equipment, business machines, power supplies and
many other industrial/consumer applications.
SMC
CASE 403
PLASTIC
Features
Working Peak Reverse Voltage Range − 5.0 V to 78 V
Standard Zener Breakdown Voltage Range − 6.7 V to 91.25 V
Peak Power − 1500 W @ 1 ms
ESD Rating of Class 3 (> 16 KV) per Human Body Model
Maximum Clamp Voltage @ Peak Pulse Current
Low Leakage < 5 mA Above 10 V
UL 497B for Isolated Loop Circuit Protection
Maximum Temperature Coefficient Specified
Response Time is Typically < 1 ns
Cathode
Anode
MARKING DIAGRAM
AYWW
Gxx G
G
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
A
Y
= Assembly Location
= Year
WW = Work Week
Gxx = Device Code (Refer to page 3)
Pb−Free Packages are Available**
G
= Pb−Free Package
(Note: Microdot may be in either location)
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
FINISH: All external surfaces are corrosion resistant and leads are
readily solderable
ORDERING INFORMATION
†
Device
Package
Shipping
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
1SMCxxxAT3G
SMC
2,500 /
260C for 10 Seconds
(Pb−Free)
Tape & Reel
LEADS: Modified L−Bend providing more contact area to bond pads
POLARITY: Cathode indicated by molded polarity notch
MOUNTING POSITION: Any
SZ1SMCxxxAT3G
SMC
(Pb−Free)
2,500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*Bidirectional devices will not be available in this series.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
**For additional information on our Pb−Free strategy and soldering details,
please download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
February, 2012 − Rev. 8
1SMC5.0AT3/D