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STM32F405VG PDF预览

STM32F405VG

更新时间: 2022-06-26 11:43:11
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 闪存
页数 文件大小 规格书
185页 5432K
描述
ARM Cortex-M4 32b MCUFPU, 210DMIPS, up to 1MB Flash/1924KB RAM, USB OTG HS/FS

STM32F405VG 数据手册

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Revision history  
STM32F405xx, STM32F407xx  
Table 98. Document revision history (continued)  
Date  
Revision  
Changes  
Removed fHSE_ext typical value in Table 29: High-speed external user  
clock characteristics. Updated Table 31: HSE 4-26 MHz oscillator  
characteristics and Table 32: LSE oscillator characteristics (fLSE =  
32.768 kHz).  
Added fPLL48_OUT maximum value in Table 35: Main PLL  
characteristics.  
Modified equation 1 and 2 in Section 5.3.11: PLL spread spectrum  
clock generation (SSCG) characteristics.  
Updated Table 38: Flash memory characteristics, Table 39: Flash  
memory programming, and Table 40: Flash memory programming with  
VPP.  
Updated Section : Output driving current.  
Table 53: I2C characteristics: Note 4 updated and applied to th(SDA) in  
Fast mode, and removed note 4 related to th(SDA) minimum value.  
3
31-May-2012  
(continued)  
Updated Table 67: ADC characteristics. Updated note concerning ADC  
accuracy vs. negative injection current below Table 68: ADC accuracy  
at fADC = 30 MHz.  
Added WLCSP90 thermal resistance in Table 96: Package thermal  
characteristics.  
Updated Table 90: WLCSP90 - 0.400 mm pitch wafer level chip size  
package mechanical data.  
Updated Figure 83: UFBGA176+25 - ultra thin fine pitch ball grid array  
10 × 10 × 0.6 mm, package outline and Table 94: UFBGA176+25 -  
ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm mechanical data.  
Added Figure 85: LQFP176 recommended footprint.  
Removed 256 and 768 Kbyte Flash memory density from Table 97:  
Ordering information scheme.  
180/185  
DocID022152 Rev 4  

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