Datasheet > STHVUP32

STHVUP32

更新时间： 2024-11-30 14:58:15

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		/
页数	文件大小	规格书
5页	1998K
描述
32 channels ±100 V, ±0.4/0.8 A, 3/5-level RTZ, TR switch, high-speed ultrasound pulser with integrated transmit beamformer

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STHVUP32 数据手册

STHVUP32

Databrief

32-channel ±100 V, ±0.8/0.4 A, 3/5-level RTZ, T/R switch, high-speed ultrasound

pulser with integrated transmit beamformer

Features

•

Pulsed wave (PW) and continuous wave (CW) mode operations:

–

3- or 5-level ±100 V output waveform

Programmable ±200 mA or ±400 mA or ±600 mA or ±800 mA source

and sink current in 3-level configuration (±400 mA or ±200 mA in 5-level

configuration)

•

Fully integrated 23 Ω resistance real clamping-to-ground function

Fully integrated 23 Ω resistance transmitting/receiving switches (TR_SW)

–

Compliant with receiver multiplexing function

•

Auxiliary integrated circuits

–

Noise-blocking diodes

Thermal protection

Undervoltage protection and bias supply checks

•

Programmable power management to optimize the performances for ultra-

portable applications

Beamforming in transmission mode

Product status link

–

Programmable single-channel delay for beam steering and focusing

Clock frequency up to 200 MHz

STHVUP32

5 ns delay resolution

From 5 ns to 20 us delay range @ 200 MHz

3 us minimum delay table writing time

Product summary

Order code

Package

Packing

STHVUP32

•

Embedded memory to store transmission patterns

FCBGA168

11.5x10.5x1.35

–

32 states for waveform definition, with waveform compression algorithm

Up to 4 different waveforms for each channel

Tray

Easy driving control

–

Control through standard Quad Serial Peripheral Interface (QSPI)

Few input signals to drive several devices

Single interrupt as alert signal

Product label

Single trigger to manage transmitting (TX) and receiving (RX) phases,

fully automatic and programmable

–

Anti-glitch on TRIGGER signal during TX phase

•

Checksum control

Very low package thermal resistance

Latch-up free due to HV SOI technology

Just a few passive components needed

Small package: BGA 11.5 mm x 10.5 mm x 1.35 mm with 168 balls and 0.8

mm pitch

Application

•

Medical ultrasound imaging

Pulse waveform generators

Ultra-portable ultrasound imaging

Piezoelectric transducer drivers

DB4798 - Rev 3 - March 2023

For further information contact your local STMicroelectronics sales office.

www.st.com

12 3 4 5

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