Datasheet > STA311BTR

STA311BTR

更新时间： 2024-01-15 08:52:34

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		电信电信集成电路
页数	文件大小	规格书
102页	1256K
描述
Multichannel digital audio processor with FFXTM

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STA311BTR 技术参数

生命周期：	Active	包装说明：	8 X 8 MM, ROHS COMPLIANT, MO-220, VFQFPN-56
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	Factory Lead Time：	12 weeks
风险等级：	1.43	JESD-30 代码：	S-XQCC-N56
长度：	8 mm	功能数量：	1
端子数量：	56	最高工作温度：	90 °C
最低工作温度：	-40 °C	封装主体材料：	UNSPECIFIED
封装代码：	HVQCCN	封装形状：	SQUARE
封装形式：	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	峰值回流温度（摄氏度）：	NOT SPECIFIED
座面最大高度：	1 mm	标称供电电压：	3.3 V
表面贴装：	YES	电信集成电路类型：	TELECOM CIRCUIT
温度等级：	INDUSTRIAL	端子形式：	NO LEAD
端子节距：	0.5 mm	端子位置：	QUAD
处于峰值回流温度下的最长时间：	NOT SPECIFIED	宽度：	8 mm
Base Number Matches：	1

STA311BTR 数据手册

STA311B

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与STA311BTR相关器件

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STA312A	ALLEGRO	Power Bipolar Transistor, 3A I(C), 60V V(BR)CEO, 3-Element, NPN, Silicon, Plastic/Epoxy, 8	获取价格
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STA320	STMICROELECTRONICS	2.1 MULTICHANNELS DIGITAL AUDIO PROCESSOR WITH DDTM	获取价格

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