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SST39VF020-90-4C-B3KE PDF预览

SST39VF020-90-4C-B3KE

更新时间: 2024-12-01 15:52:55
品牌 Logo 应用领域
芯科 - SILICON 内存集成电路
页数 文件大小 规格书
24页 716K
描述
Flash, 256KX8, 90ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, MO-210AB-1, TFBGA-48

SST39VF020-90-4C-B3KE 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:BGA包装说明:TFBGA, BGA48,6X8,32
针数:48Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.65最长访问时间:90 ns
命令用户界面:YES数据轮询:YES
JESD-30 代码:R-PBGA-B48JESD-609代码:e1
长度:8 mm内存密度:2097152 bit
内存集成电路类型:FLASH内存宽度:8
功能数量:1部门数/规模:64
端子数量:48字数:262144 words
字数代码:256000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:256KX8封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装等效代码:BGA48,6X8,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:3/3.3 V编程电压:2.7 V
认证状态:Not Qualified座面最大高度:1.2 mm
部门规模:4K最大待机电流:0.000015 A
子类别:Flash Memories最大压摆率:0.02 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:TIN SILVER COPPER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40切换位:YES
类型:NOR TYPE宽度:6 mm
Base Number Matches:1

SST39VF020-90-4C-B3KE 数据手册

 浏览型号SST39VF020-90-4C-B3KE的Datasheet PDF文件第2页浏览型号SST39VF020-90-4C-B3KE的Datasheet PDF文件第3页浏览型号SST39VF020-90-4C-B3KE的Datasheet PDF文件第4页浏览型号SST39VF020-90-4C-B3KE的Datasheet PDF文件第5页浏览型号SST39VF020-90-4C-B3KE的Datasheet PDF文件第6页浏览型号SST39VF020-90-4C-B3KE的Datasheet PDF文件第7页 
512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit (x8) Multi-Purpose Flash  
SST39LF512 / SST39LF010 / SST39LF020 / SST39LF040  
SST39VF512 / SST39VF010 / SST39VF020 / SST39VF040  
SST39LF/VF512 / 010 / 020 / 0403.0 & 2.7V 512Kb / 1Mb / 2Mb / 4Mb (x8) MPF memories  
Data Sheet  
FEATURES:  
Organized as 64K x8 / 128K x8 / 256K x8 / 512K x8  
Single Voltage Read and Write Operations  
– 3.0-3.6V for SST39LF512/010/020/040  
– 2.7-3.6V for SST39VF512/010/020/040  
Superior Reliability  
– Endurance: 100,000 Cycles (typical)  
– Greater than 100 years Data Retention  
Fast Erase and Byte-Program:  
– Sector-Erase Time: 18 ms (typical)  
– Chip-Erase Time: 70 ms (typical)  
– Byte-Program Time: 14 µs (typical)  
– Chip Rewrite Time:  
1 second (typical) for SST39LF/VF512  
2 seconds (typical) for SST39LF/VF010  
4 seconds (typical) for SST39LF/VF020  
8 seconds (typical) for SST39LF/VF040  
Low Power Consumption:  
Automatic Write Timing  
– Internal VPP Generation  
End-of-Write Detection  
Toggle Bit  
– Data# Polling  
– Active Current: 10 mA (typical)  
– Standby Current: 1 µA (typical)  
Sector-Erase Capability  
– Uniform 4 KByte sectors  
Fast Read Access Time:  
CMOS I/O Compatibility  
JEDEC Standard  
– Flash EEPROM Pinouts and command sets  
Packages Available  
– 45 ns for SST39LF512/010/020/040  
– 55 ns for SST39LF020/040  
– 70 and 90 ns for SST39VF512/010/020/040  
Latched Address and Data  
– 32-lead PLCC  
– 32-lead TSOP (8mm x 14mm)  
– 48-ball TFBGA (6mm x 8mm) for 1 Mbit  
PRODUCT DESCRIPTION  
The SST39LF512/010/020/040 and SST39VF512/010/  
020/040 are 64K x8, 128K x8, 256K x8 and 5124K x8  
CMOS Multi-Purpose Flash (MPF) manufactured with  
SST’s proprietary, high performance CMOS SuperFlash  
technology. The split-gate cell design and thick oxide tun-  
neling injector attain better reliability and manufacturability  
compared with alternate approaches. The SST39LF512/  
010/020/040 devices write (Program or Erase) with a 3.0-  
3.6V power supply. The SST39VF512/010/020/040  
devices write with a 2.7-3.6V power supply. The devices  
conform to JEDEC standard pinouts for x8 memories.  
significantly improves performance and reliability, while low-  
ering power consumption. They inherently use less energy  
during Erase and Program than alternative flash technolo-  
gies. The total energy consumed is a function of the  
applied voltage, current, and time of application. Since for  
any given voltage range, the SuperFlash technology uses  
less current to program and has a shorter erase time, the  
total energy consumed during any Erase or Program oper-  
ation is less than alternative flash technologies. These  
devices also improve flexibility while lowering the cost for  
program, data, and configuration storage applications.  
Featuring high performance Byte-Program, the  
SST39LF512/010/020/040 and SST39VF512/010/020/  
040 devices provide a maximum Byte-Program time of 20  
µsec. These devices use Toggle Bit or Data# Polling to indi-  
cate the completion of Program operation. To protect  
against inadvertent write, they have on-chip hardware and  
Software Data Protection schemes. Designed, manufac-  
tured, and tested for a wide spectrum of applications, they  
are offered with a guaranteed endurance of 10,000 cycles.  
Data retention is rated at greater than 100 years.  
The SuperFlash technology provides fixed Erase and Pro-  
gram times, independent of the number of Erase/Program  
cycles that have occurred. Therefore the system software  
or hardware does not have to be modified or de-rated as is  
necessary with alternative flash technologies, whose Erase  
and Program times increase with accumulated Erase/Pro-  
gram cycles.  
To meet surface mount requirements, the SST39LF512/  
010/020/040 and SST39VF512/010/020/040 devices are  
offered in 32-lead PLCC and 32-lead TSOP packages. The  
39LF/VF010 is also offered in a 48-ball TFBGA package.  
See Figures 1 and 2 for pinouts.  
The SST39LF512/010/020/040 and SST39VF512/010/  
020/040 devices are suited for applications that require  
convenient and economical updating of program, configu-  
ration, or data memory. For all system applications, they  
©2002 Silicon Storage Technology, Inc.  
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.  
Multi-Purpose Flash and MPF are trademarks of Silicon Storage Technology, Inc.  
These specifications are subject to change without notice.  
S71150-03-000 2/02  
1
395  

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