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SQRS152ELP

更新时间： 2024-11-24 14:54:35
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
6页 225K
描述
Automotive N-Channel 40 V (D-S) 175 °C MOSFET

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SQRS152ELP 数据手册

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SQRS152ELP  
Vishay Siliconix  
www.vishay.com  
Automotive N-Channel 40 V (D-S) 175 °C MOSFET  
FEATURES  
• TrenchFET® Gen IV power MOSFET  
PowerPAK® SO-8SW Single  
D
D
7
8
• AEC-Q101 qualified  
D
6
D
5
• 100 % Rg and UIS tested  
• Wettable flank terminals  
• Material categorization:  
for definitions of compliance please  
see www.vishay.com/doc?99912  
1
S
2
S
3
S
D
4
G
Top View  
Bottom View  
PRODUCT SUMMARY  
VDS (V)  
G
40  
R
DS(on) () at VGS = 10 V  
DS(on) () at VGS = 4.5 V  
0.0050  
0.0075  
58  
R
N-Channel MOSFET  
S
I
D (A) e  
Configuration  
Single  
ORDERING INFORMATION  
Package  
PowerPAK ® SO-8SW  
SQRS152ELP  
Lead (Pb)-free and halogen-free  
(for detailed order number please see www.vishay.com/doc?79771)  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
40  
V
VGS  
20  
TC = 25 °C  
58  
Continuous drain current e  
ID  
T
C = 125 °C  
33  
Continuous source current (diode conduction) e  
Pulsed drain current a, e  
IS  
32  
A
IDM  
IAS  
166  
Single pulse avalanche current  
Single pulse avalanche energy  
14  
L = 0.1 mH  
EAS  
9.8  
35  
mJ  
W
TC = 25 °C  
Maximum power dissipation a, e  
PD  
TC = 125 °C  
11  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) c  
TJ, Tstg  
-55 to +175  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
RthJA  
LIMIT  
42  
UNIT  
Junction-to-ambient  
Junction-to-case (drain) d  
PCB mountb  
°C/W  
RthJC  
4.3  
Notes  
a. Pulse test; pulse width 300 μs, duty cycle 2 %  
b. When mounted on 1" square PCB (FR4 material)  
c. See solder profile (www.vishay.com/doc?73257). The end of the lead terminal is exposed copper (not plated) as a result of the singulation  
process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom  
side solder interconnection  
d. As per on JESD51-14  
e. Values based on RthJC and TC of 25 °C. Actual values achievable will be dependent on the thermal characteristics of the complete system  
S23-0284-Rev. A, 08-May-2023  
Document Number: 62217  
1
For technical questions, contact: automostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
123456

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