Freescale Semiconductor
Data Sheet: Technical Data
Document Number: PXD10
Rev. 1, 09/2011
PXD10
208 LQFP
416 TEPBGA
28 mm x 28 mm
27 mm x 27 mm
PXD10 Microcontroller Data
Sheet
176 LQFP
24 mm x 24 mm
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2
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.1 Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Device comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.4 PXD10 series blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.5 PXD10 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.6 Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pinout and signal descriptions . . . . . . . . . . . . . . . . . . . . . . . 27
2.1 144 LQFP package pinouts . . . . . . . . . . . . . . . . . . . . . 27
2.2 176 LQFP package pinout . . . . . . . . . . . . . . . . . . . . . . 29
2.3 Pad configuration during reset phases. . . . . . . . . . . . . 30
2.4 Voltage supply pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.5 Pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2.6 System pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
2.7 Debug pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
2.8 Port pin summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
3.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
3.2 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . 55
3.3 NVUSRO register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
3.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . 57
3.5 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 62
3.6 Electromagnetic compatibility (EMC) characteristics . . 65
3.7 Power management electrical characteristics . . . . . . . 67
3.8 I/O pad electrical characteristics . . . . . . . . . . . . . . . . . 75
3.9 SSD specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
3.10 RESET electrical characteristics . . . . . . . . . . . . . . . . . 84
3.11 Fast external crystal oscillator (4–16 MHz) electrical characteristics87
3.12 Slow external crystal oscillator (32 KHz) electrical characteristics89
3.13 FMPLL electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . 91
3.14 Fast internal RC oscillator (16 MHz) electrical characteristics 92
3.15 Slow internal RC oscillator (128 kHz) electrical characteristics92
3.16 Flash memory electrical characteristics . . . . . . . . . . . . 93
3.17 ADC electrical characteristics. . . . . . . . . . . . . . . . . . . . 94
3.18 LCD driver electrical characteristics. . . . . . . . . . . . . . 101
3.19 Pad AC specifications. . . . . . . . . . . . . . . . . . . . . . . . . 102
3.20 AC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . 122
4.1 144 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
4.2 176 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
The PXD10 family represents a new generation of
32-bit microcontrollers based on the Power
Architecture . These devices provide a
®
cost-effective, single chip display solution for the
industrial market. An integrated TFT driver with
digital video input ability from an external video
source, significant on-chip memory, and low power
design methodologies provide flexibility and
reliability in meeting display demands in rugged
environments. The advanced processor core offers
high performance processing optimized for low
power consumption, operating at speeds as high as
64 MHz. The family itself is fully scalable from
512 KB to 1 MB internal flash memory. The
memory capacity can be further expanded via the
on-chip QuadSPI serial flash controller module.
3
The PXD10 family platform has a single level of
memory hierarchy supporting on-chip SRAM and
flash memories. The 1 MB flash version features
160 KB of on-chip graphics SRAM to buffer cost
effective color TFT displays driven via the on-chip
Display Control Unit (DCU). See Table 1 for
specific memory size and feature sets of the product
family members.
The PXD10 family benefits from the extensive
development infrastructure for Power Architecture
devices, which is already well established. This
includes full support from available software
drivers, operating systems, and configuration code
to assist with users’ implementations. See
Section 3, Developer support, for more
information.
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© Freescale Semiconductor, Inc., 2011. All rights reserved.
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