SPC5561F1MZQ132 PDF预览

SPC5561F1MZQ132

更新时间: 2025-08-21 15:19:07
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
58页 1730K
描述
NXP 32-bit MCU, Power Arch core, 1MB Flash, 132MHz, -40/+125degC, Automotive Grade, PBGA 324

SPC5561F1MZQ132 数据手册

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Document Number: MPC5561  
Rev. 3, June 2012  
Freescale  
Data Sheet: Technical Data  
MPC5561  
Microcontroller Data Sheet  
Contents  
This document provides electrical specifications, pin  
assignments, and package diagrams for the MPC5561  
microcontroller device. For functional characteristics,  
refer to the MPC5561 Microcontroller Reference  
Manual.  
1
2
3
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 4  
3.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
3.2 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . 5  
3.3 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3.4 EMI (Electromagnetic Interference) Characteristics 8  
3.5 ESD (Electromagnetic Static Discharge) Characteris-  
tics9  
1
Overview  
3.6 Voltage Regulator Controller (VRC) and  
The MPC5561 microcontroller (MCU) is a member of  
the MPC5500 family of microcontrollers built on the  
Power-On Reset (POR) Electrical Specifications9  
3.7 Power-Up/Down Sequencing . . . . . . . . . . . . . . . . 10  
3.8 DC Electrical Specifications. . . . . . . . . . . . . . . . . . 14  
3.9 Oscillator and FMPLL Electrical Characteristics . . 20  
3.10 eQADC Electrical Characteristics . . . . . . . . . . . . . 22  
3.11 H7Fa Flash Memory Electrical Characteristics . . . 23  
3.12 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 24  
3.13 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
Power Architecture embedded technology. This family  
of parts has many new features coupled with high  
performance CMOS technology to provide substantial  
reduction of cost per feature and significant performance  
improvement over the MPC500 family.  
4
5
Mechanicals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44  
4.1 MPC5561 324 PBGA Pinouts . . . . . . . . . . . . . . . . 44  
4.2 MPC5561 324-Pin Package Dimensions . . . . . . . 45  
The host processor core of this device complies with the  
Power Architecture embedded category that is 100%  
user-mode compatible (including floating point library)  
with the original PowerPC instruction set.The embedded  
architecture enhancements improve the performance in  
embedded applications. The core also has additional  
instructions, including digital signal processing (DSP)  
instructions, beyond the original PowerPC instruction  
set.  
Revision History for the MPC5561 Data Sheet . . . . . . 47  
5.1 Information Changed Between Revisions 2.0 and 3.0  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47  
5.2 Information Changed Between Revisions 1.0 and 2.0  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47  
5.3 Information Changed Between Revisions 0.0 and 1.0  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
© Freescale Inc., 2008,2012. All rights reserved.  

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