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SP0504BBCT

更新时间： 2024-11-19 22:21:31
品牌 Logo 应用领域
力特 - LITTELFUSE 瞬态抑制器二极管电视局域网
页数 文件大小 规格书
3页 169K
描述
SP0504BBCT - TVS Avalanche Diode Array in a Bipolar Chip Scale Package

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中文翻译

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SP0504BBCT 技术参数

是否Rohs认证：不符合生命周期：Obsolete
零件包装代码：CSP包装说明：R-PBGA-B6
针数：6Reach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8541.10.00.50
风险等级：5.78Is Samacsys：N
其他特性：LOW CAPACITANCE最大钳位电压：7.6 V
配置：COMMON BIPOLAR TERMINAL, 4 ELEMENTS二极管元件材料：SILICON
二极管类型：TRANS VOLTAGE SUPPRESSOR DIODEJESD-30 代码：R-PBGA-B6
JESD-609代码：e0元件数量：4
端子数量：6封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：GRID ARRAY
峰值回流温度（摄氏度）：NOT SPECIFIED极性：BIDIRECTIONAL
认证状态：Not Qualified最大重复峰值反向电压：5.9 V
子类别：Transient Suppressors表面贴装：YES
技术：AVALANCHE端子面层：Tin/Lead (Sn/Pb)
端子形式：BALL端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIEDBase Number Matches：1

SP0504BBCT 数据手册

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Next  
Previous  
Silicon Protection Circuits  
TVS Avalanche Diode Array in a Bipolar Chip Scale Package  
NEW  
SP0504BBC, SP0508BBC, SP0516BBC  
This family of avalanche diode arrays are designed for ESD protection  
and offered in an ultra small chip scale package. The multi-channel  
devices are used to help protect sensitive digital or analog input circuits  
on data, signal, or control lines with Bipolar voltage levels up to 5VDC.  
The array is ideal for protection when AC signals are present.  
The state-of-the-art structure is designed to suppress ESD and other  
transient over-voltage events to meet the International Electrotechnical  
Compatability (EMC transient immunity stantards IEC 61000-4-2 for  
Electrostatic Discharge Requirements).  
The monolithic silicon devices are comprised of specially designed  
structures for transient voltage suppression (TVS). The size and shape  
of these structures has been tailored for transient protection. The  
low capacitance and clamp voltage are ideal for high speed signal  
line protection.  
Ordering Information  
NOTE: Bump pitch is 0.65mm  
CS Package  
Size (mm)  
Quantity Per  
Reel  
Diode  
Channels Bumps  
Part Number  
SP0504BBCT  
SP0508BBCT  
SP0516BBCT  
Features  
1.804 x 1.154  
3.104 x 1.154  
3.104 x 2.454  
3500  
3500  
3500  
4
8
6
• An Array of 4, 8 and 16 Avalanche Diodes in a ultra small Chip Scale  
Package (0.65mm bump pitch)  
10  
20  
• ESD Capability per HBM Standards  
16  
- IEC 61000-4-2, Direct Discharge .............................18kV (Level 4)  
- IEC 61000-4-2, Air Discharge ..................................30kV (Level 4)  
- MIL STD 883D (Method 3015.7).............................................30kV  
• Bipolar signal line protection for applications up to 5V  
Schematic  
• Fast response time..........................................................................< 1ns  
• Low input capacitance..........................................................39pF Typical  
• Low clamp voltage .................................................................12V Typical  
• Low input leakage....................................................................10uA Max  
• Operating temperature range ...........................................- 40°C to 85°C  
SP0516BBC  
SP0504BBC  
D1  
D2  
D3  
D4  
D5  
B1  
B2  
B3  
Applications  
• Cell phone handsets  
C1  
B1  
C2  
B2  
C3  
B3  
C4  
B4  
C5  
B5  
A1  
A2  
A3  
• Personal Digital Assistants (PDA)  
• Portable handheld equipment (Laptop, Palmtop computers)  
• Computer port, keyboard (USB1.1)  
• Set-Top Box (Audio and Video ports)  
• PCMCIA cards  
SP0508BBC  
B1  
B2  
B3  
B4  
B5  
A1  
A2  
A3  
A4  
A5  
A1  
A2  
A3  
A4  
A5  
202  
www. littelfuse. com  
123

中文翻译

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