SN54ALVTH16260, SN74ALVTH16260
2.5-V/3.3-V 12-BIT TO 24-BIT MULTIPLEXED D-TYPE LATCH
WITH 3-STATE OUTPUTS
SCES332 – APRIL 2000
SN54ALVTH16260 . . . WD PACKAGE
SN74ALVTH16260 . . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
State-of-the-Art Advanced BiCMOS
Technology (ABT) Widebus Design for
2.5-V and 3.3-V Operation and Low
Static-Power Dissipation
OEA
LE1B
2B3
GND
2B2
OE2B
LEA2B
2B4
GND
2B5
1
2
3
4
5
6
7
8
9
56
55
54
53
52
51
50
49
48
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 2.3-V to
3.6-V V
)
CC
Typical V
<0.8 V at V
(Output Ground Bounce)
OLP
CC
2B1
2B6
= 3.3 V, T = 25°C
A
V
V
CC
CC
High-Drive (–24 mA/24 mA at 2.5-V and
–32/64mA at 3.3-V V
A1
A2
2B7
2B8
)
CC
I
and Power-Up 3-State Support Hot
off
A3 10
47 2B9
Insertion
GND
A4
GND
2B10
11
12
46
45
Use Bus Hold on Data Inputs in Place of
External Pullup/Pulldown Resistors to
Prevent the Bus From Floating
A5 13
A6 14
44 2B11
43 2B12
42 1B12
41 1B11
40 1B10
39 GND
38 1B9
37 1B8
36 1B7
Auto3-State Eliminates Bus Current
A7 15
Loading When Output Exceeds V
+ 0.5 V
CC
A8 16
Flow-Through Architecture Facilitates
Printed Circuit Board Layout
A9 17
GND 18
A10 19
A11 20
A12 21
Distributed V
High-Speed Switching Noise
and GND Pins Minimize
CC
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL), Thin Shrink
Small-Outline (DGG), Thin Very
Small-Outline (DGV) Packages, and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
V
22
35
V
CC
CC
1B1 23
1B2 24
GND 25
1B3 26
LE2B 27
SEL 28
34 1B6
33 1B5
32 GND
31 1B4
NOTE: For tape and reel order entry:
30 LEA1B
29 OE1B
The DGGR package is abbreviated to GR, and
the DGVR package is abbreviated to VR.
description
The ’ALVTH16260 devices are 12-bit to 24-bit multiplexed D-type latches designed for 2.5-V or 3.3-V V
operation, but with the capability to provide a TTL interface to a 5-V system environment.
CC
Three 12-bit I/O ports (A1–A12, 1B1–1B12, and 2B1–2B12) are available for address and/or data transfer. The
output-enable (OE1B, OE2B, and OEA) inputs control the bus transceiver functions. The OE1B and OE2B
control signals also allow bank control in the A-to-B direction.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright 2000, Texas Instruments Incorporated
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265