SN74LVC06A-EP
HEX INVERTER BUFFER/DRIVER
WITH OPEN DRAIN OUTPUTS
www.ti.com
SCAS832A–APRIL 2007–REVISED MAY 2007
FEATURES
•
Controlled Baseline
D PACKAGE
(TOP VIEW)
–
–
–
One Assembly Site
One Test Site
1A
1Y
2A
2Y
3A
1
2
3
4
5
6
7
14
V
CC
One Fabrication Site
13 6A
12 6Y
•
•
Extended Temperature Performance of –55°C
to 125°C
5A
5Y
4A
4Y
11
10
9
Enhanced Diminishing Manufacturing Sources
(DMS) Support
3Y
GND
•
•
•
•
Enhanced Product Change Notification
8
(1)
Qualification Pedigree
Operates From 1.65 V to 3.6 V
Inputs and Open Drain Outputs Accept
Voltages up to 5.5 V
•
•
Max tpd of 3.7 ns at 3.3 V
Ioff Supports Partial Power Down Mode
Operation
•
Latch-Up Performance Exceeds 250 mA Per
JESD 17
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION/ORDERING INFORMATION
The SN74LVC06A is a hex inverter buffer/driver that is designed for 1.65-V to 3.6-V VCC operation.
The outputs of the SN74LVC06A device are open drain and can be connected to other open-drain outputs to
implement active low wired OR or active high wired AND functions. The maximum sink current is 24 mA.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators
in a mixed 3.3 V/5 V system environment.
This device is fully specified for partial power down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
FUNCTION TABLE
(EACH INVERTER)
INPUT
A
OUTPUT
Y
H
L
L
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.