SN74CB3Q3384A
10-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS114D–DECEMBER 2002–REVISED JUNE 2005
FEATURES
•
Data and Control Inputs Provide Undershoot
Clamp Diodes
(1)
•
High-Bandwidth Data Path (up to 500 MHz
)
•
•
•
Low Power Consumption (ICC = 1 mA Typ)
VCC Operating Range From 2.3 V to 3.6 V
•
5-V Tolerant I/Os With Device Powered Up or
Powered Down
•
•
Low and Flat ON-State Resistance
(ron) Characteristics Over Operating Range
(ron = 3 Ω Typ)
Data I/Os Support 0- to 5-V Signaling Levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
•
•
•
•
Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs
Rail-to-Rail Switching on Data I/O Ports
– 0- to 5-V Switching With 3.3-V VCC
– 0- to 3.3-V Switching With 2.5-V VCC
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
•
Bidirectional Data Flow With Near-Zero
Propagation Delay
ESD Performance Tested Per JESD 22
Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
(Cio(OFF) = 4 pF Typ)
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
•
Fast Switching Frequency (fOE = 20 MHz Max)
•
Supports Both Digital and Analog
(1) For additional information regarding the performance
characteristics of the CB3Q family, refer to the TI application
report, CBT-C, CB3T, and CB3Q Signal-Switch Families,
literature number SCDA008.
Applications: PCI Interface, Differential Signal
Interface, Memory Interleaving, Bus Isolation,
Low-Distortion Signal Gating
DBQ, DGV, OR PW PACKAGE
(TOP VIEW)
1
24
23
22
21
20
19
18
17
16
15
14
13
1OE
1B1
1A1
1A2
1B2
1B3
1A3
1A4
1B4
1B5
1A5
GND
V
CC
2
2B5
2A5
2A4
2B4
2B3
2A3
2A2
2B2
2B1
2A1
2OE
3
4
5
6
7
8
9
10
11
12
DESCRIPTION/ORDERING INFORMATION
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
QSOP – DBQ
TSSOP – PW
TVSOP – DGV
Tape and reel
Tube
SN74CB3Q3384ADBQR
SN74CB3Q3384APW
SN74CB3Q3384APWR
SN74CB3Q3384ADGVR
CB3Q3384A
–40°C to 85°C
BU384A
BU384A
Tape and reel
Tape and reel
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2002–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.