SN74AXC1T45-Q1
ZHCSK32B –FEBRUARY 2019–REVISED SEPTEMBER 2019
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目录
8.3 Feature Description................................................. 20
8.4 Device Functional Modes........................................ 21
Application and Implementation ........................ 22
9.1 Application Information............................................ 22
9.2 Typical Applications ................................................ 22
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Operating Characteristics: TA = 25°C ..................... 15
6.7 Typical Characteristics............................................ 16
Parameter Measurement Information ................ 18
7.1 Load Circuit and Voltage Waveforms ..................... 18
Detailed Description ............................................ 20
8.1 Overview ................................................................. 20
8.2 Functional Block Diagram ....................................... 20
9
10 Power Supply Recommendations ..................... 25
11 Layout................................................................... 25
11.1 Layout Guidelines ................................................. 25
11.2 Layout Example .................................................... 25
12 器件和文档支持 ..................................................... 26
12.1 文档支持................................................................ 26
12.2 接收文档更新通知 ................................................. 26
12.3 支持资源................................................................ 26
12.4 商标....................................................................... 26
12.5 静电放电警告......................................................... 26
12.6 Glossary................................................................ 26
13 机械、封装和可订购信息....................................... 26
7
8
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision A (July 2019) to Revision B
Page
•
Device with DCK package is now Active status ..................................................................................................................... 3
Changes from Original (February 2019) to Revision A
Page
•
•
•
已添加 将 DRY 封装添加到“器件信息”表中............................................................................................................................. 1
Added DRY package to Pin Configuration and Functions ..................................................................................................... 3
Added DRY package to Thermal Information table................................................................................................................ 5
2
Copyright © 2019, Texas Instruments Incorporated
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