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SN74AC244-EP PDF预览

SN74AC244-EP

更新时间: 2024-11-22 11:58:19
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德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
12页 564K
描述
OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS

SN74AC244-EP 数据手册

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SN74AC244-EP  
OCTAL BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS723BOCTOBER 2003REVISED APRIL 2006  
FEATURES  
DW OR NS PACKAGE  
(TOP VIEW)  
Controlled Baseline  
– One Assembly/Test Site, One Fabrication  
Site  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
1OE  
1A1  
2Y4  
1A2  
2Y3  
1A3  
2Y2  
1A4  
2Y1  
GND  
V
CC  
2OE  
1Y1  
2A4  
1Y2  
2A3  
1Y3  
2A2  
1Y4  
2A1  
Extended Temperature Performance of –55°C  
to 125°C  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
Enhanced Product-Change Notification  
(1)  
Qualification Pedigree  
2-V to 6-V VCC Operation  
Inputs Accept Voltages to 6 V  
Max tpd of 7.5 ns at 5 V  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
DESCRIPTION  
This octal buffer and line driver is designed specifically to improve the performance and density of 3-state  
memory address drivers, clock drivers, and bus-oriented receivers and transmitters.  
The SN74AC244-EP device is organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs.  
When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the  
outputs are in the high-impedance state.  
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
ORDERING INFORMATION  
ORDERABLE PART  
TA  
PACKAGE(1)  
TOP-SIDE MARKING  
NUMBER  
SN74AC244MDWREP  
SN74AC244MNSREP  
SOIC – DW  
SOP – NS  
Tape and reel  
Tape and reel  
SAC244MEP  
SAC244MEP  
–55°C to 125°C  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
FUNCTION TABLE  
(EACH BUFFER)  
INPUTS  
OUTPUT  
Y
OE  
L
A
H
L
H
L
L
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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