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SN65LVDT14-EP PDF预览

SN65LVDT14-EP

更新时间： 2024-11-22 11:13:23
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德州仪器 - TI /
页数 文件大小 规格书
21页 484K
描述
增强型产品 Memorystick™ 内部互联扩展器芯片组

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SN65LVDT14-EP 数据手册

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SN65LVDT14-EP, SN65LVDT41-EP  
www.ti.com  
SCES633–JUNE 2005  
Memory Stick™ INTERCONNECT EXTENDER CHIPSET WITH LVDS  
SN65LVDT14 – ONE DRIVER PLUS FOUR RECEIVERS  
SN65LVDT41 – FOUR DRIVERS PLUS ONE RECEIVER  
FEATURES  
APPLICATIONS  
•
Memory Stick™ Interface Extensions With  
Long Interconnects Between Host and  
Memory Stick  
•
Controlled Baseline  
– One Assembly/Test Site, One Fabrication  
Site  
•
Serial Peripheral Interface™ (SPI™) Interface  
Extension to Allow Long Interconnects  
Between Master and Slave  
•
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
•
•
•
Enhanced Product-Change Notification  
•
•
MultiMediaCard™ (MMC) Interface in SPI  
Mode  
General-Purpose Asymmetric Bidirectional  
Communication  
(1)  
Qualification Pedigree  
Integrated 110-Ω Nominal Receiver Line  
Termination Resistor  
•
•
•
•
•
•
Operate From a Single 3.3-V Supply  
Greater Than 125-Mbps Data Rate  
Flow-Through Pinout  
DESCRIPTION  
The SN65LVDT14 combines one LVDS line driver  
with four terminated LVDS line receivers in one  
package. It is designed to be used at the Memory  
Stick™ end of an LVDS-based Memory Stick  
interface extension.  
LVTTL-Compatible Logic I/Os  
ESD Protection on Bus Pins Exceeds 12 kV  
Meet or Exceed Requirements of  
ANSI/TIA/EIA-644A Standard for LVDS  
The SN65LVDT41 combines four LVDS line drivers  
with a single terminated LVDS line receiver in one  
package. It is designed to be used at the host end of  
an LVDS-based Memory Stick interface extension.  
•
20-Pin Thin Shrink Small-Outline  
Package (PW) With 26-Mil Terminal Pitch  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
brk  
brk  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Serial Peripheral Interface, SPI are trademarks of Motorola.  
MultiMediaCard is a trademark of MultiMediaCard Association.  
Memory Stick is a trademark of Sony.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
On products compliant to MIL-PRF-38535, all parameters are  
Instruments standard warranty. Production processing does not  
tested unless otherwise noted. On all other products, production  
necessarily include testing of all parameters.  
processing does not necessarily include testing of all parameters.  
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