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SN65HVD55DG4 PDF预览

SN65HVD55DG4

更新时间： 2024-01-11 07:58:15
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
23页 1502K
描述
HIGH OUTPUT FULL-DUPLEX RS-485 DRIVERS AND RECEIVERS

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SN65HVD55DG4 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SOIC
包装说明：SOP, SOP14,.25针数：14
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：6 weeks
风险等级：5.32其他特性：SIGNALING RATE 1 MBPS
差分输出：YES驱动器位数：1
高电平输入电流最大值：0.0001 A输入特性：DIFFERENTIAL SCHMITT TRIGGER
接口集成电路类型：LINE TRANSCEIVER接口标准：EIA-485-A; TIA-485-A
JESD-30 代码：R-PDSO-G14JESD-609代码：e4
长度：8.65 mm湿度敏感等级：1
功能数量：1端子数量：14
最高工作温度：85 °C最低工作温度：-40 °C
最小输出摆幅：1.7 V输出特性：3-STATE
最大输出低电流：0.008 A输出极性：TRUE
封装主体材料：PLASTIC/EPOXY封装代码：SOP
封装等效代码：SOP14,.25封装形状：RECTANGULAR
封装形式：SMALL OUTLINE峰值回流温度（摄氏度）：260
电源：5 V认证状态：Not Qualified
最大接收延迟：60 ns接收器位数：1
座面最大高度：1.75 mm子类别：Line Driver or Receivers
最大压摆率：8 mA最大供电电压：5.5 V
最小供电电压：4.5 V标称供电电压：5 V
电源电压1-最大：5.5 V电源电压1-分钟：4.5 V
电源电压1-Nom：5 V表面贴装：YES
技术：BICMOS温度等级：INDUSTRIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED最大传输延迟：230 ns
宽度：3.9 mmBase Number Matches：1

SN65HVD55DG4 数据手册

 浏览型号SN65HVD55DG4的Datasheet PDF文件第17页浏览型号SN65HVD55DG4的Datasheet PDF文件第18页浏览型号SN65HVD55DG4的Datasheet PDF文件第19页浏览型号SN65HVD55DG4的Datasheet PDF文件第20页浏览型号SN65HVD55DG4的Datasheet PDF文件第22页浏览型号SN65HVD55DG4的Datasheet PDF文件第23页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-Nov-2005  
PACKAGING INFORMATION  
Orderable Device  
SN65HVD53D  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN65HVD53DG4  
SN65HVD53DR  
SN65HVD53DRG4  
SN65HVD54D  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
D
D
D
D
D
D
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN65HVD54DG4  
SN65HVD54DR  
SN65HVD54DRG4  
SN65HVD55D  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN65HVD55DG4  
SN65HVD55DR  
SN65HVD55DRG4  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
1...181920212223

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