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SMP3003

更新时间: 2024-01-12 02:47:28
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 104K
描述
P-Channel Power MOSFET 75V, 100A, 8.0m, TO-263-2L/TO-263

SMP3003 技术参数

生命周期:Transferred包装说明:SMALL OUTLINE, R-PSSO-G2
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.46
雪崩能效等级(Eas):468 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:75 V最大漏极电流 (Abs) (ID):100 A
最大漏极电流 (ID):100 A最大漏源导通电阻:0.011 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSSO-G2
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):90 W最大脉冲漏极电流 (IDM):400 A
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICON

SMP3003 数据手册

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Ordering number : ENA1655D  
SMP3003  
P-Channel Power MOSFET  
http://onsemi.com  
Ω
75V, 100A, 8.0m , TO-263-2L/TO-263  
Features  
TO-263  
ON-resistance R (on)1=6.2m (typ.)  
DS  
Input capacitance Ciss=13400pF (typ.)  
4V drive  
Ω
Specications  
at Ta=25°C  
Absolute Maximum Ratings  
Parameter  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current (DC)  
Symbol  
Conditions  
Ratings  
Unit  
V
V
--75  
±20  
--100  
--400  
90  
DSS  
V
V
GSS  
I
A
D
Drain Current (Pulse)  
I
PW 10 s, duty cycle 1%  
A
μ
DP  
Allowable Power Dissipation  
Channel Temperature  
P
Tc=25°C  
W
°C  
°C  
mJ  
A
D
Tch  
150  
Storage Temperature  
Tstg  
--55 to +150  
468  
Avalanche Energy (Single Pulse) *1  
Avalanche Current *2  
E
AS  
I
--60  
AV  
Note : 1 V =--48V, L=100 H, I =--60A (Fig.1)  
*
μ
DD  
2 L 100 H, Single pulse  
AV  
*
μ
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating  
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.  
at Ta=25°C  
Electrical Characteristics  
Ratings  
typ  
Parameter  
Symbol  
Conditions  
Unit  
V
min  
--75  
max  
Drain to Source Breakdown Voltage  
Zero-Gate Voltage Drain Current  
Gate to Source Leakage Current  
Cutoff Voltage  
V
I =--1mA, V =0V  
D GS  
(BR)DSS  
I
V
=--75V, V =0V  
--10  
A
A
μ
DSS  
DS GS  
I
V
=±16V, V =0V  
±10  
μ
GSS  
GS DS  
V
(off)  
|
V
=--10V, I =--1mA  
--1.2  
--2.6  
V
GS  
yfs  
DS D  
Forward Transfer Admittance  
V
I
=--10V, I =--50A  
D
140  
6.2  
S
|
DS  
R
R
(on)1  
(on)2  
=--50A, V =--10V  
GS  
8.0  
11  
m
Ω
Ω
DS  
DS  
D
Static Drain to Source On-State Resistance  
I
D
=--50A, V =--4V  
GS  
8.0  
m
Input Capacitance  
Ciss  
13400  
1000  
740  
95  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-ON Delay Time  
Rise Time  
Coss  
Crss  
V
=--20V, f=1MHz  
pF  
pF  
ns  
DS  
t
t
t
t
(on)  
d
r
1000  
800  
820  
280  
50  
ns  
See Fig.2  
Turn-OFF Delay Time  
Fall Time  
(off)  
ns  
d
f
ns  
Total Gate Charge  
Qg  
nC  
nC  
nC  
V
Gate to Source Charge  
Gate to Drain “Miller” Charge  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
Qgs  
Qgd  
V
DS  
=--48V, V =--10V, I =--100A  
GS  
D
55  
V
SD  
I =--100A, V =0V  
S
--1.0  
120  
380  
--1.5  
GS  
t
ns  
See Fig.3  
rr  
I =--100A, V =0V, di/dt=--100A/  
S
s
Q
μ
nC  
GS  
rr  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 6 of this data sheet.  
Semiconductor Components Industries, LLC, 2013  
September, 2013  
91113 TKIM TC-00002966/O2412 TKIM/53012 TKIM TC-00002772/ No. A1655-1/6  
O1211 TKIM TC-00002654/21710QA TKIM TC-00002253  

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