1808<4.5 2.0 t=0.6mm>
High Brightness Type
PSML2 (SMLK15WB
Series)
∗∗∗∗
Tentative Spec
Emitting Color
Material
White
InGaN on Si
(mm)
Package Size
(
)
(
)
4520 1808 4.5×2.0 t=0.6
Part No.
PSML2 (SMLK15WBFPW)
note) "-" will be taken out for emitting color B/E series.
Absolute Maximum Ratings (Ta=25°C)
Dimensions (Unit:mm)
2
Peak
1.5
Anode mark
Power
Forward
Reverse Operating
Storage
forward
current
Emitting
color
dissipation current
voltage temperature temperature
Part No.
∗1
PD
(mW)
IF
VR
(V)
Topr
Tstg
(°C)
∗2
IFP
(mA)
(°C)
(mA)
SMLK15WBFPW
810
180
350
5
-40 to +100 -40 to +100
White
0.4
0.2
1:Subject to adequate heat-radiation conditions of mounting board (e.g. use of metallic board, use of Cu land patterns)
2:Duty 1/10, pulse width 10ms.
1.1
Electrical Optical Characteristics (Ta=25°C)
Brightness
IV
Forward
voltage
VF
Chromaticity
coordinates
Part No.
Resin
Typ.
IF
IF
Min.
Typ.
IF
x
y
0.30
( )
V
(
)
(
)
(
)
(
)
(
)
mA
mA
cd
cd
mA
1.54
Phosphor
included
Tolerance: 0.2
SMLK15WBFPW
3.8
100
0.30
100
−
6.4
100
Directivity (Typ.)
Chromaticity Diagram
(
)
Angular Displacement deg
0.38
0°
X
Y
30°
30°
0.36
0.34
60°
60°
3
0.32
5
2
90°
100
90°
100
8
0.30
50
0
50
(
)
%
RELATIVE LUMINOUS INTENSITY
4
7
0.28
1
(
)
Angular Displacement deg
0°
6
0.26
X’
Y’
30°
30°
0.24
0.26
0.28
0.30
0.32
0.34
60°
60°
CIE x
Chromaticity Coordinates (Ta=25˚C, IF=150mA)
1
2
3
4
5
6
7
8
x
y
x
y
x
y
x
y
x
y
x
y
x
y
x
y
90°
100
90°
100
50
0
50
0.280 0.248 0.287 0.295 0.307 0.315 0.296 0.276 0.311 0.294 0.282 0.246 0.300 0.269 0.313 0.285
0.264 0.267 0.283 0.305 0.304 0.330 0.287 0.295 0.307 0.315 0.280 0.248 0.296 0.276 0.311 0.294
0.283 0.305 0.304 0.330 0.330 0.360 0.307 0.315 0.330 0.339 0.296 0.276 0.311 0.294 0.330 0.318
0.296 0.276 0.307 0.315 0.330 0.339 0.311 0.294 0.330 0.318 0.300 0.269 0.313 0.285 0.330 0.304
Measurement tolerance: 0.02
(
)
%
RELATIVE LUMINOUS INTENSITY
Recommended Pad Layout
Packaging Specifications (Unit : mm)
Tape Specifications : 1 <4,000pcs / reel>
Reel Specifications
1.74
15.4
1
4
0.1
+0.1
φ
1.5
0
2
0.05
0.3 0.05
(Unit:mm)
The recommended thickness of the screen mask
for soldering is between 100 and 150µm. The
hole size of the screen mask should be same as
the recommended land pattern or smaller.
0.8 0.1
2.2 0.1
4
0.1
Tolerance: 0.2
Tolerance: 0.2
Rev.A