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SMLJ10AHE3-TP-HF PDF预览

SMLJ10AHE3-TP-HF

更新时间: 2024-11-24 21:17:19
品牌 Logo 应用领域
美微科 - MCC 二极管
页数 文件大小 规格书
4页 320K
描述
Trans Voltage Suppressor Diode,

SMLJ10AHE3-TP-HF 技术参数

生命周期:ActiveReach Compliance Code:compliant
风险等级:5.7二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
Base Number Matches:1

SMLJ10AHE3-TP-HF 数据手册

 浏览型号SMLJ10AHE3-TP-HF的Datasheet PDF文件第2页浏览型号SMLJ10AHE3-TP-HF的Datasheet PDF文件第3页浏览型号SMLJ10AHE3-TP-HF的Datasheet PDF文件第4页 
SMLJ10AHE3 THRU SMLJ43CAHE3  
E480232  
Features  
AEC-Q101 Qualified  
For Surface Mount Application in Order to Optimize Board Space  
Built-in Strain Relief  
3000 Watt TVS  
10 to 43 Volts  
Glass Passivated Junction  
Excellent Clamping Capability  
Repetition Rate(duty cycle):0.5%  
Fast Response Time: Typical Less Than 1ps From 0V to BV Min  
Typical ID Less Than 1μA above 10V  
High Temperature Soldering: 260°C/10 Seconds at Terminals  
Halogen Free  
SMC (DO-214AB)  
(LEAD FRAME)  
Moisture Sensitivity Level 1  
Epoxy Meets UL 94 V-0 Flammability Rating  
Lead Free Finish/RoHS Compliant (Note1) ("P" Suffix Designates  
RoHS Compliant. See Ordering Information)  
G
Mechanical Data  
• Polarity: Color Band Denotes Positive End( Cathode) Except  
Bi-directional Types  
H
Cathode Mark  
• Weight: 0.007 ounce, 0.21 gram  
D
• Manufacturing Code Added for Better Tracking  
• Standard Packaging: 16mm Tape Per ( EIA 481).  
• Terminals: Solderable Per MIL-STD-750, Method 2026  
A
C
E
B
F
Maximum Ratings  
DIMENSIONS  
MM  
Operating Junction Temperature Range: -55°C to +175°C  
INCHES  
DIM  
NOTE  
Storage Temperature Range: -55°C to +175°C  
MIN MAX MIN MAX  
0.079 0.103 2.00 2.62  
0.108 0.128 2.75 3.25  
0.002 0.008 0.051 0.203  
0.006 0.012 0.152 0.305  
0.030 0.060 0.76 1.52  
0.305 0.320 7.75 8.13  
0.260 0.280 6.60 7.11  
0.220 0.245 5.59 6.22  
Thermal Resistance Junction to Lead:RthJL=17.5°C/W  
A
B
C
D
E
F
Thermal Resistance Junction to Ambient:RthJA=75°C/W  
Electrical Characteristics @ 25°C Unless Otherwise Specified  
Peak Pulse Power  
Surge Current on  
10/1000μs Waveform  
G
H
IPPM  
PPPM  
PD  
See the Table Note 2  
3000W(Min) Note 2,3  
Peak Pulse Power  
Dissipation on  
10/1000μs Waveform  
SUGGESTED SOLDER PAD LAYOUT  
4.83mm  
Power Dissipationon  
infinite heat sink  
TL = 50°C.  
6.5W  
3.18mm  
Note:  
1.78mm  
1. High Temperature Solder Exemption Applied, see EU Directive Annex 7a.  
2. Non-repetitive current pulse, per Fig.3 and derated above TA=25 °C per Fig.4.  
3. Mounted on 8.0mm2 copper pads to each terminal.  
Rev.3-1-01012019  
1/4  
MCCSEMI.COM  

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