SMCJ1.5KE6.8AP

更新时间： 2024-11-16 13:13:39

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美微科 - MCC		/
页数	文件大小	规格书
5页	244K
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数据手册

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SMCJ1.5KE6.8AP 数据手册

SMCJ1.5KE6.8(C)A

THRU

SMCJ1.5KE550(C)A

M C C

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

20736 Marilla Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

Micro Commercial Components

Features

Transient

Voltage Suppressor

6.8 to 550 Volts

1500 Watt

ꢀ For surface mount applicationsin in order to optimize board space

• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates

ꢀ Low profile package

Compliant. See ordering information)

ꢀ Fast response time: typical less than 1.0ps from 0 volts to

V_BRminimum

ꢀ Low inductance

ꢀ Excellent clamping capability

ꢀ UL Recognized File # E331408

DO-214AB

(SMCJ) (LEAD FRAME)

Mechanical Data

Epoxy meets UL 94 V-0 flammability rating

Moisture Sensitivity Level 1

ꢀ Terminals: solderable per MIL-STD-750, Method 2026

ꢀ

Polarity: Color band denotespositive end (cathode)

except Bidirectional

ꢀ

Maximum soldering temperature: 260^oC for 10 seconds

Maximum Ratings @ 25^oC Unless Otherwise Specified

Peak Pulse Current on

10/1000us waveform

I_PP

See Table 1 Note: 2

DIMENSIONS

Peak Pulse Power

Dissipation

P_PP

1500W Note: 2

INCHES

MIN

.079

.108

.002

.006

.030

..305

.260

.220

MIN

2.00

2.75

0.051

0.152

0.76

7.75

DIM

MAX

2.62

3.25

0.203

0.305

1.27

8.13

7.11

6.22

NOTE

.103

.128

.008

.012

.050

.320

.280

.245

Peak Forward Surge

Current

I_FSM)

200A

Note: 4

-55^oC to

+150^oC

Operation And Storage T_J, T_STG

Temperature Range

6.60

5.59

SUGGESTED SOLDER

PAD LAYOUT

0.190

NOTES:

0.125”

1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.

2. Non-repetitive current pulse, per Fig.3 and derated above

T_A=25^oC per Fig.2.

3. Mounted on 8.0mm²copper pads to each terminal.

4. 8.3ms, single half sine wave duty cycle=4 pulses per. Minute

maximum.

0.070”

www.mccsemi.com

1 of 5

Revision: A

2011/01/01

12 3 4 5

中文翻译

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