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SMBJ5938TRE3 PDF预览

SMBJ5938TRE3

更新时间: 2024-11-21 18:20:47
品牌 Logo 应用领域
美高森美 - MICROSEMI 测试二极管
页数 文件大小 规格书
3页 122K
描述
Zener Diode, 36V V(Z), 20%, 2W

SMBJ5938TRE3 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliant风险等级:5.8
配置:SINGLE二极管类型:ZENER DIODE
最大动态阻抗:38 Ω元件数量:1
最高工作温度:150 °C最大功率耗散:2 W
标称参考电压:36 V子类别:Voltage Reference Diodes
表面贴装:YES最大电压容差:20%
工作测试电流:10.4 mABase Number Matches:1

SMBJ5938TRE3 数据手册

 浏览型号SMBJ5938TRE3的Datasheet PDF文件第2页浏览型号SMBJ5938TRE3的Datasheet PDF文件第3页 
SMBG5913 thru SMBG5956B, e3  
SMBJ5913 thru SMBJ5956B, e3  
SILICON 2.0 Watt ZENER DIODES  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
The SMBJ5913-5956B or SMBG5913-5956B series of surface mount 2.0  
watt Zeners provides voltage regulation in a selection from 3.3 to 200  
volts with different tolerances as identified by suffix letter on the part  
number. This series is equivalent to the JEDEC registered 1N5913 thru  
1N5956B with identical electrical characteristics except it is rated at 2.0 W  
instead of 1.5 W with the lower thermal resistance features of the surface  
mount packaging. It is available in J-bend design (SMBJ) with the DO-  
214AA package for greater PC board mounting density or in Gull-wing  
design (SMBG) in the DO-215AA for visible solder connections. It is also  
available as RoHS Compliant with an e3 suffix. Microsemi also offers  
numerous other Zener products to meet higher and lower power  
NOTE: All SMB series are  
equivalent to prior SMS package  
identifications.  
applications.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Surface mount equivalent to 1N5913 to 1N5956B  
Ideal for high-density and low-profile mounting  
Zener voltage available 3.3V to 200V  
Regulates voltage over a broad operating  
current and temperature range  
Wide selection from 3.3 to 200 V  
Popular DO-214AA or DO-215AA packages  
and footprints for either high density J-bend or  
Gull-wing designs for visible solder joints  
Standard voltage tolerances are plus/minus 5% with  
B suffix and 10 % with A suffix identification  
Tight tolerances available in plus or minus 2% or 1%  
Nonsensitive to ESD per MIL-STD-750 Method  
1020  
with C or D suffix respectively  
Options for screening in accordance with MIL-PRF-19500  
for JAN, JANTX, and JANTXV are available by adding MQ,  
MX, or MV prefixes respectively to part numbers.  
Withstands high surge stresses (see Figure 2)  
Moisture classification: Level 1 per IPC/JEDEC  
J-STD-020B with no dry pack required  
RoHS Compliant devices available by adding an “e3” suffix  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Power dissipation at 25ºC: 2.0 watts (also see  
derating in Figure 1).  
CASE: Void-free transfer molded  
thermosetting epoxy body meeting UL94V-0  
Operating and Storage temperature: -65ºC to  
TERMINALS: Gull-wing or C-bend (modified  
J-bend) tin-lead or RoHS compliant annealed  
matte-Tin plating solderable per MIL-STD-750,  
method 2026  
+150ºC  
Thermal Resistance: 35 ºC/W junction to lead, or  
100ºC/W junction to ambient when mounted on FR4  
PC board (1oz Cu) with recommended footprint (see  
last page)  
POLARITY: Cathode indicated by band.  
Diode to be operated with banded end positive  
with respect to opposite end for Zener  
regulation  
Steady-State Power: 2 watts at TL < 80oC, or 1.25  
watts at TA = 25ºC when mounted on FR4 PC board  
with recommended footprint (also see Figure 1)  
MARKING: Includes part number without  
prefix (e.g. 5913B, 5913Be3, 5948C, 5956D,  
etc.)  
Forward voltage @200 mA: 1.2 volts (maximum)  
Solder Temperatures: 260 ºC for 10 s (maximum)  
TAPE & REEL option: Standard per EIA-481-1-  
A with 12 mm tape, 750 per 7 inch reel or 2500  
per 13 inch reel (add “TR” suffix to part number)  
WEIGHT: 0.1 grams  
See package dimensions on last page  
Copyright © 2007  
6-21--2007 REV H  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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