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SMBJ5928BHE3-TP PDF预览

SMBJ5928BHE3-TP

更新时间: 2024-11-30 15:51:47
品牌 Logo 应用领域
美微科 - MCC 测试光电二极管
页数 文件大小 规格书
4页 378K
描述
Zener Diode,

SMBJ5928BHE3-TP 技术参数

是否Rohs认证:符合生命周期:Active
包装说明:R-PDSO-C2Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.68Is Samacsys:N
配置:SINGLE二极管元件材料:SILICON
二极管类型:ZENER DIODE最大动态阻抗:7 Ω
最大正向电压 (VF):1.5 VJEDEC-95代码:DO-214AA
JESD-30 代码:R-PDSO-C2膝阻抗最大值:550 Ω
湿度敏感等级:1元件数量:1
端子数量:2最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性:UNIDIRECTIONAL最大功率耗散:1.5 W
参考标准:AEC-Q101标称参考电压:13 V
最大反向电流:1 µA反向测试电压:9.9 V
表面贴装:YES技术:ZENER
端子形式:C BEND端子位置:DUAL
最大电压容差:5%工作测试电流:28.8 mA
Base Number Matches:1

SMBJ5928BHE3-TP 数据手册

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M C C  
TM  
SMBJ5925BHE3  
THRU  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
Micro Commercial Components  
SMBJ5956BHE3  
Features  
1.5 Watt  
Surface Mount  
Silicon  
Halogen free  
AEC-Q101 Qualified  
Surface Mount Application  
·
10V thru 200 Volt Voltage Range  
Low Inductance, Low Profile Mounting  
Glass Passivated Junction  
Zener Diodes  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
Mechanical Data  
DO-214AA  
CASE: JEDEC DO-214AA molded Surface Mountable  
Terminals solderable per MIL-STD-750, Method 2026  
Polarity is indicated by cathode band.  
(SMB) (LEAD FRAME)  
Packaging: Standard 12mm Tape (see EIA 481)  
Maximum temperature for soldering: 260oC for 10 seconds.  
A
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
B
Maximum Ratings @ 25oC Unless Otherwise Specified  
Output  
IF  
C
200mA  
Current  
Maximum  
VF  
1.5V  
(Note: 2)  
(Note: 3)  
F
H
Forward  
Voltage  
D
G
Steady State  
Power  
P(AV)  
1.5W  
E
Dissipation  
DIMENSIONS  
Operation And  
TJ, TSTG -55oC to  
+150 oC  
INCHES  
MIN  
MM  
MIN  
4.06  
3.30  
0.15  
0.76  
5.08  
2.00  
1.91  
Storage  
DIM  
A
B
C
D
E
F
G
H
MAX  
.185  
.155  
.012  
.060  
.220  
.096  
.087  
.008  
MAX  
4.70  
3.94  
0.31  
1..52  
5.59  
2.44  
2.21  
0.203  
NOTE  
.160  
.130  
.006  
.030  
.200  
.079  
.075  
.002  
Temperature  
NOTES:  
1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
0.05  
2. Forward Current @ 200mA.  
3. Mounted on 5.0mm2 (1oz thick) Iand areas.  
SUGGESTED SOLDER  
PAD LAYOUT  
Lead temperature at TL=75oC  
0.106"  
0.083”  
0.050”  
www.mccsemi.com  
Revision: A  
2015/06/11  
1 of 4  

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