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SMBJ5923B-TP-HF PDF预览

SMBJ5923B-TP-HF

更新时间: 2024-11-23 19:38:39
品牌 Logo 应用领域
美微科 - MCC 测试二极管
页数 文件大小 规格书
4页 347K
描述
Zener Diode, 8.2V V(Z), 5%, 1.5W,

SMBJ5923B-TP-HF 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.24
配置:SINGLE二极管类型:ZENER DIODE
最大动态阻抗:3.5 Ω湿度敏感等级:1
元件数量:1最高工作温度:150 °C
峰值回流温度(摄氏度):260最大功率耗散:1.5 W
标称参考电压:8.2 V子类别:Voltage Reference Diodes
表面贴装:YES处于峰值回流温度下的最长时间:10
最大电压容差:5%工作测试电流:45.7 mA
Base Number Matches:1

SMBJ5923B-TP-HF 数据手册

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SMBJ5913B  
THRU  
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
SMBJ5956B  
Features  
1.5 Watt  
Surface Mount  
Silicon  
Halogen free available upon request by adding suffix "-HF"  
Surface Mount Application  
3.3 thru 200 Volt Voltage Range  
Low Inductance,Low Profile Mounting  
Glass Passivated Junction  
Zener Diodes  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
Mechanical Data  
DO-214AA  
CASE: JEDEC DO-214AA molded Surface Mountable  
Terminals solderable per MIL-STD-750, Method 2026  
Polarity is indicated by cathode band.  
(SMB) (LEAD FRAME)  
Packaging: Standard 12mm Tape (see EIA 481)  
Maximum temperature for soldering: 260oC for 10 seconds.  
A
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
B
Maximum Ratings @ 25oC Unless Otherwise Specified  
Output  
IF  
C
200mA  
Current  
Maximum  
VF  
1.5V  
(Note: 2)  
(Note: 3)  
F
H
Forward  
Voltage  
D
G
Steady State  
Power  
P(AV)  
1.5W  
E
Dissipation  
DIMENSIONS  
Operation And  
TJ, TSTG -55oC to  
+150 oC  
INCHES  
MIN  
MM  
MIN  
Storage  
DIM  
A
B
C
D
E
F
G
H
MAX  
.185  
.155  
.012  
.060  
.220  
.096  
.087  
.008  
MAX  
4.70  
3.94  
0.31  
1..52  
5.59  
2.44  
2.21  
0.203  
NOTE  
.160  
.130  
.006  
.030  
.200  
.079  
.075  
.002  
4.06  
3.30  
0.15  
0.76  
5.08  
2.00  
1.91  
0.05  
Temperature  
NOTES:  
1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
2. Forward Current @ 200mA.  
3. Mounted on 5.0mm2 (1oz thick) Iand areas.  
SUGGESTED SOLDER  
PAD LAYOUT  
Lead temperature at TL=75oC  
0.106"  
0.083”  
0.050”  
www.mccsemi.com  
Revision: D  
2013/01/01  
1 of 4  

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