SMBJ5382BP

更新时间： 2024-01-13 01:32:25

品牌	Logo	应用领域
美微科 - MCC		稳压二极管齐纳二极管测试光电二极管
页数	文件大小	规格书
4页	1236K
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中文翻译

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数据手册

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SMBJ5382BP 数据手册

M C C

SMBJ5333B

THRU

SMBJ5388B

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

21201 Itasca Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

Features

5 Watt

Surface Mount

Silicon

Zener Diodes

Low profile package for surface mounting (flat handling

surface for accurate placement)

Zener Voltage 3.3V to 200V

High Surge Current Capability

For available tolerances – see note 1

Available on Tape and Reel (see EIA std RS-481)

Mechanical Data

DO-214AA

(SMBJ) (Round Lead)

Standard JEDEC outlines as shown

Terminals gull-wing or c-bend (modified J-bend) tin-lead plated

and solderable per MIL-STD-750, method 2026

Polarity is indicated by cathode band

Maximum temperature for soldering: 260^oC for 10 seconds.

Cathode Band

Maximum Ratings @ 25^oC Unless Otherwise Specified

V_F

1.2 Volts

Forward Voltage at 1.0A

Current

P_(AV)

5 Watts

See note 2

Steady State Power

Dissipation

-55^oC to

+ 150^oC

T_J, T_STG

Operating and Storage

Temperatures

25^oC/W

R_qJL

DIMENSIONS

Thermal Resistance

INCHES

MIN

.078

.075

.002

-----

.035

.065

.205

.160

.130

MIN

1.98

1.90

.05

-----

.90

1.65

5.21

4.06

3.30

DIM

MAX

.116

.089

.008

.02

.055

.091

.224

.180

.155

MAX

2.95

2.25

.20

NOTE

Notes

1. Mounted on copper pads as shown below.

.51

2. Lead temperature at 25^oC = T_Lat mounting plane. Derate

1.40

2.32

5.69

4.57

3.94

linearly above 25^oC to zero power at 150 ^oC

PAD LAYOUT

Modified J Bend

0.090"

0.085”

0.070”

www.mccsemi.com

12 3 4

中文翻译

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