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SMBJ5362C-TP PDF预览

SMBJ5362C-TP

更新时间: 2024-11-23 10:49:35
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
5页 359K
描述
Zener Diode, 28V V(Z), 2%, 5W, Silicon, Unidirectional, DO-214AA, PLASTIC, SMB, 2 PIN

SMBJ5362C-TP 数据手册

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SMBJ5338B  
THRU  
SMBJ5388B  
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
5 Watt  
xꢀ Low Profile Package for Surface Mountiong(Flat Handling  
Surface for Accurate Placement)  
Surface Mount Silicon  
Zener Diode  
xꢀ Zener Voltage 5.1V to 200V  
xꢀ High Surge Current Capability  
xꢀ For Available Tolerances-see Note 1  
5.1 to 200 Volts  
xꢀ Available on Tape and Reel (see E1A std RS-481)  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
DO-214AA  
(SMB) (Lead Frame)  
Halogen free available upon request by adding suffix "-HF"  
H
Mechanical Data  
xꢀ Standard JEDEC Outlines as Shown  
xꢀ Marking: See page 2  
J
xꢀ Maximum Temperature for Soldering: 260к for 10 Seconds  
·
·
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
Electrical Characteristics @ 25qC Unless Otherwise Specified  
A
C
Forward Voltage at  
VF  
1.2Volts  
1.0A Current  
E
D
B
Steady State Power  
Dissipation  
P(AV)  
5Watts See Note 2  
-55к to +150к  
Operating and Storage  
Temperatures  
G
TJ, TSTG  
DIMENSIONS  
15к/W  
90к/W  
R șJL  
RșJA  
INCHES  
MIN  
.075  
.077  
.002  
-----  
.030  
.200  
.160  
.130  
MM  
MIN  
1.91  
1.96  
.05  
-----  
.76  
5.08  
4.06  
3.30  
Thermal Resistance  
DIM  
A
B
C
D
E
G
H
MAX  
.095  
.083  
.008  
.02  
.060  
.220  
.187  
.155  
MAX  
2.41  
2.10  
.20  
NOTE  
Note:  
1.High Tempertaure Solder Exemptions Applied,see EU Directive Annex 7.  
2. Lead temperature at 75к = TL at mounting plane. Derate linearly  
.51  
1.52  
5.59  
4.75  
3.94  
above 75к to zero power at 150 к  
3. Ambient temperature at 15к = TA at mounting plane. Derate linearly  
J
above 15к to zero power at 150 к  
SUGGESTED SOLDER  
PAD LAYOUT  
0.090"  
0.085”  
0.070”  
www.mccsemi.com  
1 of 5  
Revision: I  
2013/01/01  

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