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SMBJ5.0CA

更新时间: 2024-02-08 10:04:41
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 二极管光电二极管局域网
页数 文件大小 规格书
10页 133K
描述
Transil

SMBJ5.0CA 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:DO-214AA
包装说明:SMBJ, 2 PIN针数:2
Reach Compliance Code:unknown风险等级:5.62
Base Number Matches:1

SMBJ5.0CA 数据手册

 浏览型号SMBJ5.0CA的Datasheet PDF文件第2页浏览型号SMBJ5.0CA的Datasheet PDF文件第3页浏览型号SMBJ5.0CA的Datasheet PDF文件第4页浏览型号SMBJ5.0CA的Datasheet PDF文件第5页浏览型号SMBJ5.0CA的Datasheet PDF文件第6页浏览型号SMBJ5.0CA的Datasheet PDF文件第7页 
SMBJ  
Transil™  
Features  
Peak pulse power:  
– 600 W (10/1000 μs)  
– 4 kW (8/20 µs)  
A
Stand off voltage range: from 5 V to 188 V  
Unidirectional and bidirectional types  
K
Unidirectional  
Bidirectional  
Low leakage current:  
– 0.2 µA at 25 °C  
– 1 µA at 85 °C  
SMB  
(JEDEC DO-214AA)  
Operating T  
: 150 °C  
j max  
High power capability at T  
:
j max  
– 515 W (10/1000 µs)  
Description  
JEDEC registered package outline  
The SMBJ Transil series has been designed to  
protect sensitive equipment against electrostatic  
discharges according to IEC 61000-4-2, and  
MIL STD 883, method 3015, and electrical over  
stress according to IEC 61000-4-4 and 5. These  
devices are more generally used against surges  
below 600 W (10/1000 μs).  
Complies with the following standards  
IEC 61000-4-2 level 4:  
– 15 kV (air discharge)  
– 8 kV (contact discharge)  
IEC 61000-4-5  
MIL STD 883G, method 3015-7 Class 3B:  
Planar technology makes these devices suitable  
for high-end equipment and SMPS where low  
leakage current and high junction temperature are  
required to provide reliability and stability over  
time.  
– 25 kV HBM (human body model)  
Resin meets UL 94, V0  
MIL-STD-750, method 2026 soldererability  
EIA STD RS-481 and IEC 60286-3 packing  
IPC 7531 footprint  
SMBJ are packaged in SMB (SMB footprint in  
accordance with IPC 7531 standard).  
TM: Transil is a trademark of STMicroelectronics  
October 2010  
Doc ID 5616 Rev 10  
1/10  
www.st.com  
10  

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