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SMBJ4738AP PDF预览

SMBJ4738AP

更新时间: 2024-11-23 13:01:35
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美高森美 - MICROSEMI 二极管齐纳二极管
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SMBJ4738AP 数据手册

 浏览型号SMBJ4738AP的Datasheet PDF文件第2页浏览型号SMBJ4738AP的Datasheet PDF文件第3页 
SMBG4728 thru SMBG4764A  
SMBJ4728 thru SMBJ4764A  
SILICON 2.0 Watt ZENER DIODES  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
The SMBJ4728A-4764A and SMBG4728A-4764A series of surface mount  
2.0 watt Zeners provides voltage regulation in a selection from 3.3 to 100  
volts with different tolerances as identified by suffix letter on the part  
number. This surface mount product series with lower thermal resistance  
features is equivalent to the JEDEC registered 1N4728 thru 1N4764A  
with identical electrical characteristics except it is rated at 2.0 W instead  
of 1.0 W. It is available in J-bend design (SMBJ) with the DO-214AA  
package for greater PC board mounting density or in Gull-wing design  
(SMBG) in the DO-215AA for visible solder connections. Microsemi also  
offers numerous other Zener products to meet higher and lower power  
applications.  
NOTE: All SMB series are equivalent  
to prior SMS package identifications.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Surface mount equivalent to 1N4728 to 1N4764A  
Ideal for high-density and low-profile mounting  
Zener voltage available 3.3V to 200V  
Regulates voltage over a broad operating current  
and temperature range  
Wide selection from 3.3 to 100 V  
Popular DO-214AA or DO-215AA packages and  
footprints for either high density J-bend or Gull-wing  
designs for visible solder joints  
Standard voltage tolerances are plus/minus 5% with  
A suffix and 10 % with no suffix identification  
Tight tolerances available in plus or minus 2% or  
1% with C or D suffix respectively  
Options for screening in accordance with MIL-PRF-  
19500 for JAN, JANTX, JANTXV, and JANS are  
available by adding MQ, MX, MV, or MSP prefixes  
respectively to part numbers.  
Nonsensitive to ESD per MIL-STD-750 Method  
1020  
Moisture classification: Level 1 per IPC/JEDEC J-  
STD-020B with no dry pack required  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Power dissipation at 25ºC: 2.0 watts (also see  
derating in Figure 1).  
CASE: Void-free transfer molded thermosetting  
epoxy body meeting UL94V-0  
Operating and Storage temperature: -65ºC to  
+150ºC  
TERMINALS: Gull-wing or C-bend (modified J-  
bend) leads, tin-lead plated solderable per MIL-STD-  
750, method 2026  
POLARITY: Cathode indicated by band. Diode to  
be operated with the banded end positive with  
respect to opposite end for Zener regulation  
Thermal Resistance: 35 ºC/W junction to lead, or  
100ºC/W junction to ambient when mounted on FR4  
PC board (1oz Cu) with recommended footprint  
(see last page)  
Steady-State Power: 2 watts at TL < 80oC, or 1.25  
watts at TA = 25ºC when mounted on FR4 PC board  
with recommended footprint (also see Figure 1)  
MARKING: Includes part number without prefix  
(e.g. 4728A, 4734C, 4764D, etc.)  
TAPE & REEL option: Standard per EIA-481-1-A  
with 12 mm tape, 750 per 7 inch reel or 2500 per 13  
inch reel (add “TR” suffix to part number)  
WEIGHT: 0.1 grams  
See package dimensions on last page  
Forward voltage @200 mA: 1.2 volts (maximum)  
Solder Temperatures: 260 ºC for 10 s (maximum)  
Copyright 2002  
Microsemi  
Page 1  
8-21-2003 REV C  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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