SMBJ5.0 thru SMBJ170A, CA, e3
and SMBG5.0 thru SMBG170A, CA, e3
SURFACE MOUNT 600 Watt
Transient Voltage Suppressor
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
This SMBJ5.0-170A or SMBG5.0-170A series of surface mount 600 W
Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive
components from destruction or degradation. It is available in J-bend design
(SMBJ) with the DO-214AA package for greater PC board mounting density or
in a Gull-wing design (SMBG) in the DO-215AA for visible solder connections.
It is also available in both unidirectional and bidirectional configurations with a
C or CA suffix part number as well as RoHS Compliant with an e3 suffix. Their
response time is virtually instantaneous. As a result, they can be used for
protection from ESD or EFT per IEC61000-4-2 and IEC61000-4-4, or for
inductive switching environments and induced RF protection. They can also
protect from secondary lightning effects per IEC61000-4-5 and class levels
defined herein. Microsemi also offers numerous other TVS products to meet
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
higher and lower power demands and special applications.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
• Available in both unidirectional and bidirectional
•
•
Economical surface mount design in both J-bend or
Gull-wing terminations
construction (add C or CA suffix for bidirectional)
• Selections for 5.0 to 170 volts standoff voltages (VWM
)
Protects sensitive components such as IC’s, CMOS,
Bipolar, BiCMOS, ECL, DTL, T2L, etc.
• Optional 100% screening for avionics grade is available
by adding MA prefix to part number for 100% temperature
cycle -55oC to +125oC (10X) as well as surge (3X) and 24
hours HTRB with post test VZ & IR (in operating direction
for unidirectional or both directions for bidirectional)
•
•
Protection from switching transients & induced RF
Compliant to IEC61000-4-2 and IEC61000-4-4 for
ESD and EFT protection respectively
•
Secondary lightning protection per IEC61000-4-5 with
42 Ohms source impedance:
• Options for screening in accordance with MIL-PRF-19500
for JANTX are available by adding MX prefix to the part
number.
Class 1: SMB 5.0 to SMB 120A or CA
Class 2: SMB 5.0 to SMB 60A or CA
Class 3: SMB 5.0 to SMB 30A or CA
Class 4: SMB 5.0 to SMB 15A or CA
• Axial-lead equivalent packages for thru-hole mounting
available as P6KE6.8 to P6KE200CA (consult factory for
other surface mount options)
•
•
Secondary lightning protection per IEC61000-4-5 with
12 Ohms source impedance:
• Moisture classification is Level 1 with no dry pack required
per IPC/JEDEC J-STD-020B
Class 1: SMB 5.0 to SMB 36A or CA
Class 2: SMB 5.0 to SMB 18A or CA
• RoHS compliant devices available by adding an “e3” suffix
•
MAXIMUM RATINGS
• Peak Pulse Power dissipation at 25ºC: 600 watts at
10/1000 μs (also see Fig 1,2, and 3).
MECHANICAL AND PACKAGING
•
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
• Impulse repetition rate (duty factor): 0.01%
•
TERMINALS: Gull-wing or C-bend (modified J-bend)
tin-lead or RoHS compliant annealed matte-tin plating
solderable per MIL-STD-750, method 2026
• tclamping (0 volts to V(BR) min.): < 100 ps theoretical for
unidirectional and < 5 ns for bidirectional
• Operating and Storage temperature: -65ºC to +150ºC
•
•
•
POLARITY: Cathode indicated by band. No marking
on bi-directional devices
• Thermal resistance: 25 ºC/W junction to lead, or 90ºC/W
junction to ambient when mounted on FR4 PC board (1oz
Cu) with recommended footprint (see last page)
MARKING: Part number without standard prefix (e.g.
5.0, 5.0A, 5.0CA, 5.0Ae3, 36, MX36A, 36CAe3, etc.)
• Steady-State Power dissipation: 5 watts at TL = 25oC, or
1.38 watts at TA = 25ºC when mounted on FR4 PC board
with recommended footprint
TAPE & REEL option: Standard per EIA-481-1-A with
12 mm tape, 750 per 7 inch reel or 2500 per 13 inch
reel (add “TR” suffix to part number)
•
•
WEIGHT: 0.1 grams
• Forward Surge at 25ºC: 100 Amps peak impulse of 8.3
See package dimension on last page
ms half-sine wave (unidirectional only)
• Solder temperatures: 260 ºC for 10 s (maximum)
Copyright © 2009
SA3-37, REV J, 5-24-2009
Microsemi
Page 1
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
5秒后页面跳转
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
