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SMBJ20TR PDF预览

SMBJ20TR

更新时间： 2024-11-29 10:30:51
品牌 Logo 应用领域
美高森美 - MICROSEMI 局域网光电二极管电视
页数 文件大小 规格书
4页 176K
描述
600W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA, PLASTIC PACKAGE-2

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中文翻译

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SMBJ20TR 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：DO-214AA包装说明：R-PDSO-C2
针数：2Reach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8541.10.00.50
风险等级：5.18最大击穿电压：27.1 V
最小击穿电压：22.2 V击穿电压标称值：24.65 V
最大钳位电压：35.8 V配置：SINGLE
二极管元件材料：SILICON二极管类型：TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码：DO-214AAJESD-30 代码：R-PDSO-C2
JESD-609代码：e0湿度敏感等级：1
最大非重复峰值反向功率耗散：600 W元件数量：1
端子数量：2最高工作温度：150 °C
最低工作温度：-65 °C封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：NOT SPECIFIED极性：UNIDIRECTIONAL
最大功率耗散：1.38 W认证状态：Not Qualified
最大重复峰值反向电压：20 V子类别：Transient Suppressors
表面贴装：YES技术：AVALANCHE
端子面层：Tin/Lead (Sn90Pb10)端子形式：C BEND
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

SMBJ20TR 数据手册

 浏览型号SMBJ20TR的Datasheet PDF文件第2页浏览型号SMBJ20TR的Datasheet PDF文件第3页浏览型号SMBJ20TR的Datasheet PDF文件第4页 
SMBJ5.0 thru SMBJ170A, CA, e3  
and SMBG5.0 thru SMBG170A, CA, e3  
SURFACE MOUNT 600 Watt  
Transient Voltage Suppressor  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This SMBJ5.0-170A or SMBG5.0-170A series of surface mount 600 W  
Transient Voltage Suppressors (TVSs) protects a variety of voltage-sensitive  
components from destruction or degradation. It is available in J-bend design  
(SMBJ) with the DO-214AA package for greater PC board mounting density or  
in a Gull-wing design (SMBG) in the DO-215AA for visible solder connections.  
It is also available in both unidirectional and bidirectional configurations with a  
C or CA suffix part number as well as RoHS Compliant with an e3 suffix. Their  
response time is virtually instantaneous. As a result, they can be used for  
protection from ESD or EFT per IEC61000-4-2 and IEC61000-4-4, or for  
inductive switching environments and induced RF protection. They can also  
protect from secondary lightning effects per IEC61000-4-5 and class levels  
defined herein. Microsemi also offers numerous other TVS products to meet  
NOTE: All SMB series are  
equivalent to prior SMS package  
identifications.  
higher and lower power demands and special applications.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
• Available in both unidirectional and bidirectional  
•
•
Economical surface mount design in both J-bend or  
Gull-wing terminations  
construction (add C or CA suffix for bidirectional)  
• Selections for 5.0 to 170 volts standoff voltages (VWM  
)
Protects sensitive components such as IC’s, CMOS,  
Bipolar, BiCMOS, ECL, DTL, T2L, etc.  
• Optional 100% screening for avionics grade is available  
by adding MA prefix to part number for 100% temperature  
cycle -55oC to +125oC (10X) as well as surge (3X) and 24  
hours HTRB with post test VZ & IR (in operating direction  
for unidirectional or both directions for bidirectional)  
•
•
Protection from switching transients & induced RF  
Compliant to IEC61000-4-2 and IEC61000-4-4 for  
ESD and EFT protection respectively  
•
Secondary lightning protection per IEC61000-4-5 with  
42 Ohms source impedance:  
• Options for screening in accordance with MIL-PRF-19500  
for JANTX are available by adding MX prefix to the part  
number.  
Class 1: SMB 5.0 to SMB 120A or CA  
Class 2: SMB 5.0 to SMB 60A or CA  
Class 3: SMB 5.0 to SMB 30A or CA  
Class 4: SMB 5.0 to SMB 15A or CA  
• Axial-lead equivalent packages for thru-hole mounting  
available as P6KE6.8 to P6KE200CA (consult factory for  
other surface mount options)  
•
•
Secondary lightning protection per IEC61000-4-5 with  
12 Ohms source impedance:  
• Moisture classification is Level 1 with no dry pack required  
per IPC/JEDEC J-STD-020B  
Class 1: SMB 5.0 to SMB 36A or CA  
Class 2: SMB 5.0 to SMB 18A or CA  
• RoHS compliant devices available by adding an “e3” suffix  
•
MAXIMUM RATINGS  
• Peak Pulse Power dissipation at 25ºC: 600 watts at  
10/1000 μs (also see Fig 1,2, and 3).  
MECHANICAL AND PACKAGING  
•
CASE: Void-free transfer molded thermosetting  
epoxy body meeting UL94V-0  
• Impulse repetition rate (duty factor): 0.01%  
•
TERMINALS: Gull-wing or C-bend (modified J-bend)  
tin-lead or RoHS compliant annealed matte-tin plating  
solderable per MIL-STD-750, method 2026  
• tclamping (0 volts to V(BR) min.): < 100 ps theoretical for  
unidirectional and < 5 ns for bidirectional  
• Operating and Storage temperature: -65ºC to +150ºC  
•
•
•
POLARITY: Cathode indicated by band. No marking  
on bi-directional devices  
• Thermal resistance: 25 ºC/W junction to lead, or 90ºC/W  
junction to ambient when mounted on FR4 PC board (1oz  
Cu) with recommended footprint (see last page)  
MARKING: Part number without standard prefix (e.g.  
5.0, 5.0A, 5.0CA, 5.0Ae3, 36, MX36A, 36CAe3, etc.)  
• Steady-State Power dissipation: 5 watts at TL = 25oC, or  
1.38 watts at TA = 25ºC when mounted on FR4 PC board  
with recommended footprint  
TAPE & REEL option: Standard per EIA-481-1-A with  
12 mm tape, 750 per 7 inch reel or 2500 per 13 inch  
reel (add “TR” suffix to part number)  
•
•
WEIGHT: 0.1 grams  
• Forward Surge at 25ºC: 100 Amps peak impulse of 8.3  
See package dimension on last page  
ms half-sine wave (unidirectional only)  
• Solder temperatures: 260 ºC for 10 s (maximum)  
Copyright © 2009  
SA3-37, REV J, 5-24-2009  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  
1234

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