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SMAJ18CA-TP PDF预览

SMAJ18CA-TP

更新时间: 2024-11-14 13:13:35
品牌 Logo 应用领域
美微科 - MCC 二极管光电二极管局域网
页数 文件大小 规格书
4页 229K
描述
Trans Voltage Suppressor Diode, 400W, 18V V(RWM), Bidirectional, 1 Element, Silicon, DO-214AC, ROHS COMPLIANT, PLASTIC, SMA, 2 PIN

SMAJ18CA-TP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:DO-214AC
包装说明:R-PDSO-C2针数:2
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:1.35
其他特性:UL RECOGNIZED最大击穿电压:22.1 V
最小击穿电压:20 V击穿电压标称值:21.05 V
最大钳位电压:29.2 V配置:SINGLE
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码:DO-214ACJESD-30 代码:R-PDSO-C2
JESD-609代码:e3湿度敏感等级:1
最大非重复峰值反向功率耗散:400 W元件数量:1
端子数量:2封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性:BIDIRECTIONAL
最大功率耗散:1 W认证状态:Not Qualified
最大重复峰值反向电压:18 V子类别:Transient Suppressors
表面贴装:YES技术:AVALANCHE
端子面层:Matte Tin (Sn)端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:10
Base Number Matches:1

SMAJ18CA-TP 数据手册

 浏览型号SMAJ18CA-TP的Datasheet PDF文件第2页浏览型号SMAJ18CA-TP的Datasheet PDF文件第3页浏览型号SMAJ18CA-TP的Datasheet PDF文件第4页 
M C C  
SMAJ5.0  
THRU  
SMAJ440CA  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
400 Watt  
For Surface Mount Applications  
Unidirectional And Bidirectional  
Low Inductance  
High Temp Soldering: 260°C for 10 Seconds At Terminals  
For Bidirectional Devices Add “C” To The Suffix of The Part  
Transient Voltage  
Suppressors  
5.0 to 440 Volts  
Number: i.e.SMAJ5.0CA for 5% Tolerance  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
DO-214AC  
UL Recognized File # E331408  
(SMA)(LEAD FRAME)  
0HFKDQLFDOꢀ'DWD  
·
·
A
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
Polarity: Indicated by cathode band except bi-directional types  
B
0D[LPXPꢀ5DWLQJꢁꢀ  
Operating Temperature: -55°C to +150°C  
C
Storage Temperature: -55°C to +150°C  
Typical Thermal Resistance: 25 /W Junction to Ambient  
F
H
D
Peak Pulse Current on  
10/1000  
G
IPPM  
See Table 1 Note 2  
Min 400 W Note 2, 6  
E
DIMENSIONS  
Peak Pulse Power Dissipation  
PPPM  
INCHES  
MIN  
MM  
MIN  
DIM  
A
B
C
D
E
F
G
H
MAX  
.181  
.114  
.012  
.060  
.208  
.096  
.062  
.008  
MAX  
4.60  
2.90  
0.305  
1..52  
5.28  
2.44  
NOTE  
.157  
.098  
.006  
.030  
.188  
.078  
.055  
.002  
4.00  
2.50  
0.152  
0.76  
4.80  
2.00  
1.40  
Steady State Power Dissipation PM(AV)  
Peak Forward Surge Current IFSM  
1.0 W  
40A  
Note 2, 5  
Note:5  
1.60  
0.203  
0.051  
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
SUGGESTED SOLDER  
PAD LAYOUT  
2. Non-repetitive current pulse, per Fig.3 and derated above  
TA=25 per Fig.2.  
0.090 ”  
MAX  
3. Mounted on 5.0mm2 copper pads to each terminal.  
4. 8.3ms, single half sine wave duty cycle = 4 pulses per  
Minutes maximum.  
0.058 ”  
MIN  
5. Lead temperature at TL = 75  
6. Peak pulse power waveform is 10/1000  
.
.
0.070"  
MIN  
www.mccsemi.com  
1 of 4  
Revision: B  
2011/09/16  

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