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SMAF11A PDF预览

SMAF11A

更新时间: 2024-11-02 14:49:07
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
5页 955K
描述
Tape&Reel: 10Kpcs/Reel;

SMAF11A 数据手册

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SMAF5.0(C)A THRU SMAF300(C)A  
Features  
IEC 61000-4-2 ESD 30kV(Air), 30kV (Contact)  
For Surface Mount Applications  
Unidirectional And Bidirectional  
400 Watt TVS  
Fast Response Time:Typical Less Than 1ps From 0V to BV Min  
High Temp Soldering: 260°C / 10 Seconds At Terminals  
5.0 to 300 Volts  
For Bidirectional Devices Add “C” To The Suffix of  
The Part Number: i.e.SMAF5.0CA for 5% Tolerance  
Halogen Free. “Green” Device (Note 1)  
Moisture Sensitivity Level 1  
Epoxy Meets UL 94 V-0 Flammability Rating  
Lead Free Finish/RoHS Compliant (Note2) ("P" Suffix Designates  
RoHS Compliant. See Ordering Information)  
DO-221AC(SMA-FL)  
Mechanical Data  
Polarity: Indicated by Cathode Band Except Bi-directional Types  
Cathode Mark  
B
D
Maximum Ratings  
Operating Junction Temperature Range: -55°C to +175°C  
E1  
E
Storage Temperature Range: -55°C to +175°C  
Typical Thermal Resistance: 30°C/W Junction to Lead  
Typical Thermal Resistance: 120°C/W Junction to Ambient  
C
A
L
L
Peak Pulse Power  
IPPM  
Surge Current with a  
10/1000μs Waveform  
See the Table Note 3  
Peak Pulse Power  
Dissipation  
PPPM  
400W(Min.) Note 3,4,7  
DIMENSIONS  
MM  
INCHES  
DIM  
NOTE  
MIN MAX MIN MAX  
0.035 0.049 0.90 1.25  
0.049 0.065 1.25 1.65  
0.004 0.016 0.10 0.40  
0.089 0.116 2.25 2.95  
0.173 0.220 4.40 5.60  
Steady State Power  
Dissipatoin  
PM(AV)  
1.5 W  
Note 3,6  
A
B
C
D
E
8.3ms Single Half Sine-  
Wave Uni-directional  
Only(Note 5)  
Peak Forward Surge  
Current  
IFSM  
40 A  
E1 0.126 0.181 3.20 4.60  
0.020 0.059 0.50 1.50  
L
Note:  
1. Halogen free "Green" products are defined as those which contain <900ppm bromine,  
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.  
2. High Temperature Solder Exemption Applied, see EU Directive Annex 7a.  
3. Non-repetitive current pulse, per Fig.3 and derated above TA=25 °C per Fig.4.  
Suggested Solder Pad Layout  
inch  
0.232  
(5.9)  
mm  
4. Mounted on 5.0mm2 copper pads to each terminal.  
5. Mounted on 0.2" x 0.2" (5.0 x 5.0 mm) copper pads to each terminal.  
6. Lead temperature at TL = 75°C.  
7. Peak pulse power waveform is 10/1000us.  
0.075  
(1.9)  
Pin Configuration:  
0.106  
(2.7)  
0.063  
(1.6)  
Cathode  
Anode  
Uni-directional  
Bi-directional  
1/5  
MCCSEMI.COM  
Rev.3-2-12012020  

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