3 0 5 3 1 1 J S
版数
VER.
年月日
D A T E
ꢀꢀꢀꢀꢀꢀꢀꢀ変 更 内 容
ꢀꢀꢀꢀꢀꢀꢀꢀDESCRIPTION
製ꢀ図
DR.
担ꢀ当
CHK.
査ꢀ閲
APPD.
承ꢀ認
APPD.
CN NO.
) . O N G N I W A R D ( 号 番 面 図
10.45 ±0.1
10.45 ±0.1
9.25
18.5
A
X ±0.05
1.35 max.
1.35 max.
0.5
(PITCH)
(COMPONENT
HEIGHT)
(COMPONENT HEIGHT)
D
PIN 75 (NOTE3)
(PIN 67)
0.15 ±0.05 (×34)
0.2 A
(-)
(+)
KEY #(TABLE1)
2.68
3
c
PIN 1
1
d
C
L
G-
C
L
A-
4
DESIGNATION
J A E
× × × ×
× × × ×
(NOTE5)
LOT NO.
(NOTE5)
A
TOP VIEW
1.75
3.58
PIN 74 (NOTE3)
(PIN 66)
MATING CONDITION
SCALE (10:1)
B
PIN 2
7.1
0.15 ±0.05 (×33)
0.2 A
2
R0.5 ±0.15
(VACUUM AREA) (NOTE4)
(吸着エリア)
0.5
a
b
(PITCH)
0.8 ±0.08
(PAD AREA)
E
PIN 1
0.35 ±0.04 (×34)
0.13 D E F
18
PIN 75 (NOTE2)
(PIN 67)
0.5
F
c
20.15 ±0.1
H
0.05 D
21.9 ±0.1
X ±0.03
d
(PITCH)
18.5
NOTE5.PRODUCTION LOT No.&MODIFY CODE AS INDICATED.
(Ex. LOT NO.) T 5 Y B
(DEFINED BY
DATUM H)
19.85 ±0.15
G
1.83 ±0.2
4.5 ±0.2
LOT NUMBER OF CURRENT DAY
(SEE TABLE 4)
C
L
H-
(+)
(-)
18
MONTH (1 TO 9 FOR JAN. TO SEPT,
RESPECTIVELY,
b
a
OCT.:0, NOV.:X, DEC.:Y)
YEAR (LAST DIGIT ONLY)
MANUFACTURE CODE
0.5(PITCH)
DETAIL B
SCALE(10:1)
0.35 ±0.04
(×33)
PIN 74 (NOTE2)
(PIN 66)
PIN 2
C
L
A-
1.72
1.83
(DESIGNATION) S M 3 A
0.13 D E F
0.05 D
0.9 ±0.05
10 ±0.025
1.4 ±0.05
KEY POSITION
TYPE:A,B,E,M
10 ±0.025
2.45 ±0.15
5.15 ±0.15
FULL R
SERIES PREFIX
21.9 ±0.1
DESIGNATION
18.5
d
1.2 ±0.03
c
C
SM3ZS067U410※※
KEY POSITION
TYPE:A,B,E,M
SERIES
シリーズ
0.5
MODULE SEATING PLANE
Z:LIF TYPE
Z:低挿入タイプ
BOTTOM VIEW
PIN 1
0.3 ±0.03
0.1 B C
CONTACT FINISH
接点仕上げ
A:Au(0.13μm MIN)
B:Au(0.25μm MIN)
PIN 75 (NOTE2)
(PIN 67)
S:STANDARD
NO. OF CONTACTS
芯数
1.2 ±0.065
PRODUCT HEIGHT
製品高さ
DETAIL A
SCALE(10:1)
MOUNTING TYPE
実装タイプ
U:ON BOARD TYPE
215:2.15mm
310:3.10mm
410:4.10mm
9
1.1 ±0.05
1.6 ±0.05
APPLICABLE MODULE DIMENSION(REF.)
SCALE(5:1)
TABLE 1
HOLD DOWN
4
3
2 COPPER ALLOY
34 COPPER ALLOY
TIN PLATING OVER NI
CONTACT AREA:
KEY#
X
a
b
c
d
B
A
B
E
M
+6.625
+5.625
+2.625
-6.125
1
2
5
14.5
13.5
10.5
1.5
1.5
2.5
5.5
14
14.5
13.5
10.5
2
REFER TO DESIGNATION
SOLDERING AREA:
Au FLASH OVER Ni
CONTACT AREA:
REFER TO DESIGNATION
SOLDERING AREA:
Au FLASH OVER Ni
TOP SIDE CONTACT
0.3 ±0.03
0.1 B C
PIN 74 (NOTE2)
(PIN 66)
PIN 2
a
BOTTOM SIDE CONTACT
INSULATOR
2
1
33 COPPER ALLOY
1 THERMO PLASTIC
14
0.5
TABLE 2
b
符号
NO.
名ꢀꢀꢀ称
DESCRIPTION
個ꢀ数
QTY.
材ꢀꢀ料
MATERIAL
仕ꢀ上
FINISH
備ꢀꢀ考
REMARKS
COMPONENT HEGHTS
FOR MODULES
Z
18
仕様書(SPECIFICATION)
第1版(ORIGINAL DATE)
尺度(SCALE)
シリーズ(SERIES)
1.2 MAX
1.35 MAX
1.5 MAX
4.55 MAX RSS
4.70 MAX RSS
4.85 MAX RSS
08/JAN/2013
SM3
日本航空電子工業株式会社
10 ±0.025
10 ±0.025
5:1
製図
DR.
名称(TITLE)
JAPAN AVIATION
ELECTRONICS
INDUSTRY,LTD.
一般公差(GENERAL TOLERANCE)
APPLICABLE P.C.B. DIMENSION(REF.)
SCALE(5:1)
担当
CHK.
S.YAMAGUCHI
R.KATOU
SM3ZS067U410※※
(NGFF
Double-Sided modules)
NOTE1. THE COPLANARITY OF CONTACT AND HOLD DOWN SHALL BE 0.1 MAXIMUM ON THE SURFACE TABLE.
NOTE2. THIS NUMBER IS PIN-OUT NUMBER DEFINED BY NGFF SPECIFICATION.
NOTE3. THIS CONNECTOR IS HALOGEN FREE CORRESPONDENCE PRODUCT.
寸法(DIMENSION)
角度(ANGLES)
査閲
APPD.
±
±0.8
.
°
±
’
版数
(VER.)
承認
APPD.
図面番号(DRAWING NO.)
SJ113503
±0.4
±
NOTE4. THIS AREA SHALL NOT SHOW ANY BURRS AND UNEVEN SURFACE BY EJECTOR PIN MARK,
.
T.SHINDOU
°
TOOL PARTING LINE, AND ANY OTHER FACTORS.
.
.
質量(MASS)
0.1
1
単位(UNIT):㎜
±
S/W
0
70
80
90
30
40
50
10
20
60
100
JAEConnectorDIV. Proprietary.Copyright(C)2013, JapanAviationElectronicsIndustry, LTD.