Datasheet > SM1SMB5933BT3G

SM1SMB5933BT3G

更新时间： 2024-11-21 15:51:35

品牌	Logo	应用领域
安森美 - ONSEMI		测试光电二极管
页数	文件大小	规格书
6页	162K
描述
SM1SMB5933BT3G

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中文翻译

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技术参数
数据手册

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SM1SMB5933BT3G 技术参数

生命周期：	Active	包装说明：	R-PDSO-C2
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8541.10.00.50	风险等级：	5.8
配置：	SINGLE	二极管元件材料：	SILICON
二极管类型：	ZENER DIODE	最大动态阻抗：	17.5 Ω
最大正向电压 (VF)：	1.5 V	JESD-30 代码：	R-PDSO-C2
膝阻抗最大值：	650 Ω	元件数量：	1
端子数量：	2	最高工作温度：	150 °C
最低工作温度：	-65 °C	封装主体材料：	PLASTIC/EPOXY
封装形状：	RECTANGULAR	封装形式：	SMALL OUTLINE
极性：	UNIDIRECTIONAL	最大功率耗散：	0.55 W
标称参考电压：	22 V	最大反向电流：	1 µA
反向测试电压：	16.7 V	表面贴装：	YES
技术：	ZENER	端子形式：	C BEND
端子位置：	DUAL	最大电压容差：	5%
工作测试电流：	17 mA	Base Number Matches：	1

SM1SMB5933BT3G 数据手册

1SMB59xxBT3G Series,

SZ1SMB59xxT3G Series

3 Watt Plastic

Surface Mount

Zener Voltage Regulators

This complete new line of 3 W Zener diodes offers the following

advantages.

http://onsemi.com

PLASTIC SURFACE MOUNT

ZENER VOLTAGE

REGULATOR DIODES

3.3−200 V, 3 W DC POWER

Features

 Zener Voltage Range − 3.3 V to 200 V

 ESD Rating of Class 3 (> 16 kV) per Human Body Model

 Flat Handling Surface for Accurate Placement

 Package Design for Top Side or Bottom Circuit Board Mounting

 AEC−Q101 Qualified and PPAP Capable − SZ1SMB59xxT3G

 SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements

SMB

CASE 403A

PLASTIC

 Pb−Free Packages are Available*

Mechanical Characteristics:

CASE: Void-free, transfer-molded plastic

FINISH: All external surfaces are corrosion resistant and leads are

readily solderable

Cathode

Anode

MARKING DIAGRAM

MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES:

260C for 10 Seconds

LEADS: Modified L−Bend providing more contact area to bond pads

POLARITY: Cathode indicated by polarity band

FLAMMABILITY RATING: UL 94 V−0

AYWW

9xxB G

MAXIMUM RATINGS

= Assembly Location

= Year

Rating

Symbol Value

Unit

WW = Work Week

9xxB = Device Code (Refer to page 3)

Maximum Steady State Power

Dissipation @ T = 75C

3.0

Measured at Zero Lead Length

Derate Above 75C

Thermal Resistance from Junction−to−Lead

= Pb−Free Package

mW/C

C/W

(Note: Microdot may be in either location)

Maximum Steady State Power

ORDERING INFORMATION

Dissipation @ T = 25C (Note )

550

4.4

226

mW/C

C/W

Derate Above 25C

Thermal Resistance from

Junction−to−Ambient

†

Device

Package

Shipping

1SMB59xxBT3G

SMB

2,500 /

(Pb−Free)

Tape & Reel

Operating and Storage Temperature Range

T , T

−65 to

+150

C

stg

SZ1SMB59xxBT3G

SMB

2,500 /

(Pb−Free)

Tape & Reel

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−4 board, using recommended footprint.

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics table on page 3 of

this data sheet.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

 Semiconductor Components Industries, LLC, 2012

Publication Order Number:

January, 2012 − Rev. 8

1SMB5913BT3/D

12 3 4 5 6

中文翻译

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