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SL2LTE1651F PDF预览

SL2LTE1651F

更新时间: 2024-11-22 08:46:59
品牌 Logo 应用领域
大兴电工 - KOA 电阻器
页数 文件大小 规格书
1页 155K
描述
Fixed Resistor, Metal Glaze/thick Film, 2W, 1650ohm, 500V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 4528, CHIP

SL2LTE1651F 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active包装说明:CHIP
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8533.21.00.30风险等级:5.25
构造:MoldedJESD-609代码:e0
安装特点:SURFACE MOUNT端子数量:2
最高工作温度:180 °C最低工作温度:-55 °C
封装高度:2.5 mm封装长度:11.5 mm
封装形状:RECTANGULAR PACKAGE封装形式:SMT
封装宽度:7 mm包装方法:TR, EMBOSSED PLASTIC, 10 INCH
额定功率耗散 (P):2 W额定温度:70 °C
参考标准:AEC-Q200电阻:1650 Ω
电阻器类型:FIXED RESISTOR系列:SL
尺寸代码:4528子类别:Fixed Resistors
表面贴装:YES技术:METAL GLAZE/THICK FILM
温度系数:100 ppm/ °C端子面层:Tin/Lead (Sn/Pb)
端子形状:WRAPAROUND容差:1%
工作电压:500 V

SL2LTE1651F 数据手册

  
POWER TYPE RESISTORS  
METAL PLATE  
TECHNOLOGY OF TOMORROW  
LOW OHM  
STRUCTURE  
SL • SLN • TSL  
1 Mold resin  
2 Resistive element*  
3 Electrode  
* SL1: for R 120 mΩ an internal thick film resistor is used  
SL2: for R 390 mΩ an internal thick film resistor is used  
IDENTIFICATION  
COATING  
COLOR  
TYPE  
MARKING  
White  
Products with Pb-free terminations  
meet RoHS requirements  
SL, SLN, TSL  
Black  
(resistance and tolerance)  
TYPE DESIGNATION (HOW TO ORDER)  
Old Part No.  
SL  
1
F
TE  
TE  
R±±ꢀ  
New Part No.  
(Pb-free)  
SL  
1
T
ꢀL±±  
F
PRODUCT CODE  
POWER  
RATING  
1W, 2W  
TOLERANCE  
TOLERANCE  
D: 0.5ꢀ  
F: 1ꢀ  
NOMINAL  
TERMINATION  
SURFACE MATERIAL  
T: Sn  
TAPING*  
SL, SLN  
TSL  
TE, BK  
RESISTANCE  
D, F: 4 digits  
G: 2ꢀ  
J: 5ꢀ  
G, J: 3 digits  
L: Sn/Pb  
*Please see “PACKAGING”  
FEATURES  
DIMENSIONS (mm)  
Current detecting resistors with ultra low resistance (3mΩ…) and high accuracy ( 0.5ꢀ)  
Excellent terminal strength and solderability due to structure of a metal plate  
terminal electrode  
TYPE  
L ±±.3  
W ±±.2  
t ±±.2  
a ±±.2  
b ±±.2  
c
TSL1  
SL1  
SL2  
6.3  
6.3  
11.5  
11.5  
3.1  
3.1  
7.0  
7.0  
1.0  
1.9  
2.5  
2.4  
2.4  
2.4  
5.0  
5.5  
0.7  
1.2  
1.7  
1.6  
1.2 0.3  
1.2 0.3  
2.6 0.5  
2.55 0.4  
Non-wirewound structure and excellent freꢁuency characteristics  
Excellent dimension accuracy, mountability and shock resistance due to molding  
Easily absorbs thermal expansion and shrinkage because of metal plate terminal structure  
Encapsulated with flame retardant resin molding (UL94 V-0)  
For high ohmic values (up to 22MΩ) an internal thick film resistor is used  
TSL-series is the low profile version  
SLN2  
SL1 and TSL1 have standard chip size 2512  
Ideal for current detection in notebooks, battery packs, AC adapters, DC/DC converters etc.  
Meets or exceeds IEC 60115-1, JIS C 5201-1  
Rated ambient temperature: +70°C  
Operating temperature range: -55°C…+180°C  
Suitable for reflow, wave and iron soldering  
TEMPERATURE RISE  
DERATING CURVE  
Regarding the temperature rise, the value of the temperature varies per conditions and board for use since the temperature is measured under our measuring conditions.  
RATING  
RESISTANCE RANGE**  
MAX.  
MAX.  
POWER*  
RATING  
SIZE  
TYPE  
T.C.R. (ppm/K)  
WORKING OVERLOAD  
D (±±.ꢀ5)  
E24 • E96***  
F (±15)  
G (±25)  
E24  
J (±ꢀ5)  
E24  
VOLTAGE  
VOLTAGE  
E24 • E96  
TSL1  
SL1  
10 mΩ ...100 mΩ 5 mΩ ...100 mΩ  
5 mΩ ...100 mΩ  
180 (R ; 13 mΩ)  
100 (R 615 mΩ)  
1 W  
2512  
4528  
200 V  
400 V  
10 mΩ…1 MΩ  
10 mΩ…1 MΩ  
5 mΩ …1 MΩ 3 mΩ, 4 mΩ 3 mΩ …22 MΩ  
5 mΩ …1 MΩ 3 mΩ, 4 mΩ 3 mΩ …22 MΩ  
180 (R ; 10 mΩ)  
100 (R 611 mΩ)  
SL2  
2 W  
2 W  
500 V  
1000 V  
110 (R  
< 10 mΩ)  
NEW  
4528  
SLN2  
5 mΩ…110 mΩ 5 mΩ…110 mΩ  
5 mΩ…110 mΩ  
75 (R 610 mΩ)  
*
For resistors operated at an ambient temperature of +70°C or above, the power rating shall be derated in accordance with the above derating curve. Rated voltage = kP·R  
** Within the mentioned ranges, the following ohmic values are also available: 3mΩ, 4mΩ, 5mΩ, 6mΩ, 7mΩ, 8mΩ, 9mΩ  
*** E-96 values for tolerance D( 0.5ꢀ) upon reꢁuest.  
EUROPE GmbH • Kaddenbusch 6 • D-25578 Dägeling / ITZEHOE • PHONE: +49 (0) 48 21/89 89-0 • FAX: +49 (0) 48 21/89 89 89 • Internet: www.koaeurope.de  
Revision: 29. Apr. 2005  

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