SK32AF - SK310AF
SURFACE MOUNT SCHOTTKY BARRIER DIODES
VOLTAGE RANGE: 20 - 100V
CURRENT: 3.0 A
Features
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For Surface Mounted Applications
High Temperature Metallurgically Bonded Contacts
Plastic Material - UL Flammability
Classification 94V-0
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High Reliability
B
High Current Capability and Low VF
Submersible Temperature of 265°C for
10 Seconds in Solder Bath
C
E
Mechanical Data
SMAF
Dim Min Max Typ
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Case: SMAF,Molded Plastic
D
A
B
C
D
E
H
L
4.75 4.85
3.68 3.72
4.80
3.70
2.60
1.00
Terminals: Solder Plated, Solderable
per MIL-STD-750, Method 2026
H
2.57
2.63
L
0.097 1.03
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Polarity:Color band denotes cathode end
Mounting Position:Any
1.38 1.42 1.40
0.13 0.17 0.15
0.63 0.67 0.65
E
Weight:0.0018 ounce, 0.064 grams
All Dimensions in mm
A
Maximum Ratings and Electrical Characteristics
TA = 25ꢀC unless otherwise specified
For capacitive load, derate current by 20%.
Single phase, half wave, 60Hz, resistive or inductive load.
Characteristic
Symbol
SK38AF SK310AF
SK32AF SK33AF SK34AF SK35AF SK36AF
Unit
20
14
20
30
21
30
40
28
40
50
35
50
60
42
60
80
56
80
100
70
Maximum repetitive peak reverse voltage
Maximum RMS voltage
V
V
V
VRRM
VRMS
VDC
100
Maximum DC blocking voltage
Maximum average forward rectified current
at TL(see fig.1)
I(AV)
3.0
A
Peak forward surge current
IFSM
100.0
0.70
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
A
VF
IR
0.55
0.85
V
Maximum instantaneous forward voltage at 3.0A
Maximum DC reverse current TA=25 C
0.5
mA
at rated DC blocking voltage
TA=100 C
20
10
Typical junction capacitance (NOTE 1)
CJ
pF
500
300
°C/W
JA
ꢀ
R
Typical thermal resistance (NOTE 2)
Operating junction temperature range
55.0
-65 to +125
-65 to +150
-65 to +150
°C
°C
TJ,
Storage temperature range
TSTG
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.P.C.B. mounted with 0.2x0.2”(5.0x5.0mm) copper pad areas
1 of 2
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