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Si8851EDB PDF预览

Si8851EDB

更新时间: 2024-11-19 14:54:19
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 189K
描述
P-Channel 20 V (D-S) MOSFET

Si8851EDB 数据手册

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Si8851EDB  
Vishay Siliconix  
www.vishay.com  
P-Channel 20 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
• TrenchFET® power MOSFET  
• Small 2.4 mm x 2 mm outline area  
• Low 0.4 mm max. profile  
VDS (V)  
RDS(on) () Max.  
ID (A) a, d Qg (Typ.)  
0.0080 at VGS = -4.5 V  
0.0086 at VGS = -3.7 V  
0.0110 at VGS = -2.5 V  
0.0185 at VGS = -1.8 V  
-16.7  
-16.1  
70 nC  
-14.2  
-20  
• Typical ESD protection 6000 V HBM  
-11  
• Material categorization: for definitions  
of compliance please see www.vishay.com/doc?99912  
®
Power MICRO FOOT 2.4 x 2  
S
APPLICATIONS  
5
4
• Battery switch / load switch  
• Power management  
3
0.4 mm  
2
1
G
8851  
xxx  
• For smart phones, tablet PCs, and  
mobile computing  
A
B
C
G
D
S
D
E
F
A1  
D
Backside View  
Bump Side View  
P-Channel MOSFET  
Ordering Information:  
Si8851EDB-T2-E1 (Lead (Pb)-free and halogen-free)  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
-20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
8
TA = 25 °C  
TA = 70 °C  
TA = 25 °C  
TA = 70 °C  
-16.7 a  
-13.4 a  
-7.7 b  
-6.2 b  
-80  
-2.6 a  
-0.55 b  
3.1 a  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
Pulsed Drain Current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
TA = 25 °C  
TA = 25 °C  
TA = 70 °C  
TA = 25 °C  
TA = 70 °C  
Continuous Source-Drain Diode Current  
2 a  
Maximum Power Dissipation  
PD  
W
0.66 b  
0.43 b  
-55 to +150  
260  
Operating Junction and Storage Temperature Range  
Package Reflow Conditions c  
TJ, Tstg  
VPR  
°C  
IR/Convection  
260  
Notes  
a. Surface mounted on 1" x 1" FR4 board with full copper, t = 5 s.  
b. Surface mounted on 1" x 1" FR4 board with minimum copper, t = 5 s.  
c. Refer to IPC/JEDEC® (J-STD-020), no manual or hand soldering.  
d. Based on TA = 25 °C.  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
Typical  
Maximum  
40  
Unit  
Maximum Junction-to-Ambient a, b  
Maximum Junction-to-Ambient c, d  
t = 5 s  
t = 5 s  
30  
RthJA  
°C/W  
145  
188  
Notes  
a. Surface mounted on 1" x 1" FR4 board with full copper.  
b. Maximum under steady state conditions is 85 °C/W.  
c. Surface mounted on 1" x 1" FR4 board with minimum copper.  
d. Maximum under steady state conditions is 330 °C/W.  
S15-1120-Rev. B, 18-May-15  
Document Number: 64197  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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