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SI4739-C40-GM PDF预览

SI4739-C40-GM

更新时间: 2024-02-25 21:07:52
品牌 Logo 应用领域
芯科 - SILICON 电信电信集成电路
页数 文件大小 规格书
42页 1752K
描述
Telecom Circuit, 1-Func, CMOS, ROHS COMPLIANT, QFN-20

SI4739-C40-GM 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:ROHS COMPLIANT, QFN-20Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.7
JESD-30 代码:S-XQCC-N20长度:3 mm
功能数量:1端子数量:20
最高工作温度:85 °C最低工作温度:-20 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):NOT SPECIFIED座面最大高度:0.6 mm
标称供电电压:3.3 V表面贴装:YES
技术:CMOS电信集成电路类型:TELECOM CIRCUIT
温度等级:OTHER端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:3 mm
Base Number Matches:1

SI4739-C40-GM 数据手册

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