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SI4706-D50 PDF预览

SI4706-D50

更新时间: 2024-02-13 17:09:51
品牌 Logo 应用领域
芯科 - SILICON /
页数 文件大小 规格书
36页 1353K
描述
HIGH-PERFORMANCE FM AND RDS/RBDS RECEIVER

SI4706-D50 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:2.17
商用集成电路类型:AUDIO DEMODULATORBase Number Matches:1

SI4706-D50 数据手册

 浏览型号SI4706-D50的Datasheet PDF文件第1页浏览型号SI4706-D50的Datasheet PDF文件第2页浏览型号SI4706-D50的Datasheet PDF文件第3页浏览型号SI4706-D50的Datasheet PDF文件第5页浏览型号SI4706-D50的Datasheet PDF文件第6页浏览型号SI4706-D50的Datasheet PDF文件第7页 
Si4706-D50  
1. Electrical Specifications  
Table 1. Recommended Operating Conditions*  
Parameter  
Analog Supply Voltage  
Symbol  
Test Condition  
Min  
2.7  
1.62  
10  
Typ  
Max  
5.5  
3.6  
Unit  
V
V
A
Digital and Interface Supply Voltage  
Analog Power Supply Powerup Rise Time  
Digital Power Supply Powerup Rise Time  
Ambient Temperature  
V
V
D
V
µs  
µs  
C  
ARISE  
DRISE  
V
10  
T
–20  
25  
85  
A
*Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.  
Typical values apply at VA = 3.3 V and 25 C unless otherwise stated. Parameters are tested in production unless  
otherwise stated.  
Table 2. Absolute Maximum Ratings1,2  
Parameter  
Symbol  
Value  
–0.5 to 5.8  
–0.5 to 3.9  
10  
Unit  
V
Analog Supply Voltage  
V
A
Digital and Interface Supply Voltage  
V
V
D
3
Input Current  
I
mA  
V
IN  
3
Input Voltage  
V
T
–0.3 to (V + 0.3)  
IN  
IO  
Operating Temperature  
Storage Temperature  
–40 to 95  
–55 to 150  
0.4  
C  
C  
OP  
T
STG  
4
RF Input Level  
V
pK  
Notes:  
1. Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation  
should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure beyond  
recommended operating conditions for extended periods may affect device reliability.  
2. The Si4706 device is a high-performance RF integrated circuit with certain pins having an ESD rating of < 2 kV HBM.  
Handling and assembly of these devices should only be done at ESD-protected workstations.  
3. For input pins DFS, SCLK, SEN, SDIO, RST, RCLK, GPO1, GPO2, and GPO3.  
4. At RF input pins FMI and LPI.  
4
Rev. 1.0  

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