Datasheet > SH32N65DM6AG

SH32N65DM6AG

更新时间： 2023-12-20 18:45:09

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		/
页数	文件大小	规格书
14页	471K
描述
Automotive-grade N-channel 650 V, 89 mOhm typ., 32 A MDmesh DM6 half-bridge topology Power MOSFET in an ACEPACK SMIT package

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SH32N65DM6AG 数据手册

SH32N65DM6AG

Datasheet

Automotive-grade N-channel 650 V, 89 mΩ typ., 32 A MDmesh DM6

half‑bridge topology Power MOSFET in an ACEPACK SMIT package

Features

DS(on)

max.

Order code

SH32N65DM6AG

650 V

97 mΩ

32 A

•

AQG 324 qualified

Half-bridge power module

650 V blocking voltage

Fast recovery body diode

Very low switching energies

Low package inductance

ACEPACK SMIT

9 (DC+)

GADG060720221002SA

Dice on direct bond copper (DBC) substrate

Low thermal resistance

Isolation rating of 3.4 kVrms/min

1 (GHS)

2 (KHS)

Applications

7 (U)

3, 4 (NC)

•

Switching applications

6 (GLS)

5 (KLS)

Description

This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT

is a very compact and rugged power module in a surface mount package for easy

assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low

thermal resistance coupled with an isolated top-side thermal pad. The high design

flexibility of the package enables several configurations, including phase legs, boost,

and single switch through different combinations of the internal power switches.

8 (DC-)

Product status link

SH32N65DM6AG

Product summary

Order code

Marking

SH32N65DM6AG

H32N65DM6

Package

Packing

ACEPACK SMIT

Tape and reel

DS14049 - Rev 2 - October 2022

For further information contact your local STMicroelectronics sales office.

www.st.com

12 3 4 5 6 7...14

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