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SGC101B2S PDF预览

SGC101B2S

更新时间: 2024-09-26 01:24:51
品牌 Logo 应用领域
固锝 - GOOD-ARK /
页数 文件大小 规格书
4页 415K
描述
Surface Mount Schottky Rectifier

SGC101B2S 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliant风险等级:5.84

SGC101B2S 数据手册

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SGC101B2S  
Surface Mount Schottky Rectifier  
Reverse Voltage 120V Forward Current 10A  
Features  
• Heatsink design  
• Schottky barrier diodes  
• Low forward voltage drop  
• Low leakage current  
• Moisture sensitivity: level 1, per J-STD-020  
• Solder dip 260 °C, 10 s  
• Low profile - typical height of 1.1 mm  
• High temperature soldering guaranteed: 260℃/10 seconds  
eSGC (TO-277)  
Anode 1  
Cathode  
& Heatsink  
Anode 2  
• Halogen-free according to IEC 61249-2-21 definition  
Typical Applications  
For low voltage high frequency inverters, DC/DC converters and polarity protection application.  
Maximum Ratings (TA = 25 °C unless otherwise noted)  
SGC101B2S  
Unit  
Parameter  
Symbol  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
120  
84  
VRRM  
VRMS  
VDC  
V
V
V
Maximum DC blocking voltage  
120  
5.01)  
10.02)  
Maximum average forward rectified current  
IF(AV)  
A
Peak forward surge current 8.3 ms single  
half sine-wave superimposed on rated load  
175  
IFSM  
A
Operating junction and storage temperature  
range  
-55 to +150  
TJ, TSTG  
°C  
Electrical Characteristics (TA = 25 °C unless otherwise noted)  
TYP.  
MAX.  
Unit  
Parameter  
Test Conditions  
Symbol  
IF=1A  
0.40  
0.44  
0.54  
0.68  
0.29  
0.36  
0.48  
0.57  
0.015  
10.4  
0.45  
0.49  
0.60  
0.75  
-
IF=2A  
TA=25℃  
IF=5A  
IF=10A  
IF=1A  
Volts  
VF  
Maximum instantaneous forward voltage  
IF=2A  
-
TA=125℃  
IF=5A  
-
IF=10A  
-
TA=25℃  
Rated VR  
0.2  
30  
Maximum DC reverse current at rated DC  
blocking voltage  
IR  
mA  
pF  
TA=125℃  
Typical junction capacitance  
4.0 V, 1 MHz  
juntion to ambient  
juntion to lead  
CJ  
975  
27  
3
1)  
RθJA  
Typical thermal resistance  
℃/W  
2)  
RθJL  
Note1)Mounted on FR-4 P.C.B with 30*30mm copper pad area  
2)On aluminum substrate PCB with recommended copper pad area  
www.goodark.com  
1/4  
2015.08-Rev.A  

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