Datasheet > SGC101BSA_15

SGC101BSA_15

更新时间： 2024-09-26 01:25:59

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描述
Surface Mount Schottky Rectifier Reverse Voltage 100V Forward Current 10A

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SGC101BSA_15 数据手册

SGC101BSA

Surface Mount Schottky Rectifier

Reverse Voltage 100V Forward Current 10A

Features

• Schottky barrier diodes

• Low forward voltage drop

• Low leakage current

• Moisture sensitivity: level 1, per J-STD-020

• Solder dip 260 °C, 10 s

eSGC (TO‐277)

• Low profile - typical height of 1.1 mm

• Heatsink design

• High temperature soldering guaranteed: 260℃/10 seconds

Anode 1

Cathode

& Heatsink

Anode 2

• Halogen-free according to IEC 61249-2-21 definition

Typical Applications

For low voltage high frequency inverters, DC/DC converters and polarity protection application.

Maximum Ratings (TA = 25 °C unless otherwise noted)

SGC101BSA

Unit

Parameter

Symbol

Maximum repetitive peak reverse voltage

100

VRRM

Maximum RMS voltage

100

5.0

VRMS

VDC

IF(AV)¹⁾

IF(AV)²⁾

Maximum DC blocking voltage

Maximum average forward rectified current

10.0

Peak forward surge current 8.3 ms single

half sine-wave superimposed on rated load

220

IFSM

Operating junction and storage temperature

range

-55 to +150

TJ, TSTG

°C

Electrical Characteristics (TA = 25 °C unless otherwise noted)

TYP.

MAX.

Unit

Parameter

Test Conditions

Symbol

I_F=1A

0.38

0.41

0.54

0.50

14.9

9.6

I_F=2A

I_F=10A

T_A=25℃

V_F

Instantaneous forward voltage

Volts

0.65

0.60

TA=125℃

T_A=25℃

T_A=125℃

T_A=25℃

VR=80V

I_R

Instantaneous reverse current

29.5

15.2

500

VR=100V

T_A=125℃

Typical junction capacitance

4.0 V, 1 MHz

C_J

290

juntion to ambient

juntion to mount

℃/W

R_θJA

Typical thermal resistance

℃/W

R_θJM

Notes1)Thermal resistance R_θJAis junction to ambient. Free air,mounted on P.C.B with recommended copper pad area,2 OZ,FR4

2)Thermal resistance R_θJMis junction to mount.Mounted on P.C.B with 30*30mm copper pad area

www.goodark.com

1/4

2014.03-Rev.A

12 3 4

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