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SED1670 PDF预览

SED1670

更新时间: 2024-11-29 03:32:51
品牌 Logo 应用领域
爱普生 - EPSON 驱动器
页数 文件大小 规格书
8页 41K
描述
Dot Matrix High Duty LCD Driver

SED1670 数据手册

 浏览型号SED1670的Datasheet PDF文件第2页浏览型号SED1670的Datasheet PDF文件第3页浏览型号SED1670的Datasheet PDF文件第4页浏览型号SED1670的Datasheet PDF文件第5页浏览型号SED1670的Datasheet PDF文件第6页浏览型号SED1670的Datasheet PDF文件第7页 
PF836-02  
SED1670  
Dot Matrix High Duty LCD Driver  
100 Output  
1/64 to 1/300 in display duty  
CMOS High Voltage Resistant Process  
OVERVIEW  
The SED1670 is a 100 output low-power resistance common (row) driver which is suitable for driving a very high  
capacity dotmatrix LCD panels upto a duty ratio of 1/300. It is intended to be used in conjunction with the SED1640D  
or SED1606D as a pair.  
Since the SED1670 is so designed to drive LCDs over a wide range of voltages, and also the maximum potential  
V0 of its LCD drive bias voltages is isolated from VDD to allow the LCD driving bias voltages to be externally  
generated optionally with a high accuracy, it can cope with a wide range of LCD panels.  
Owing to its pad layout which can minimize its PC boards mounting space in addition to its selectable bidirectional  
driver output sequence and as many as 100 LCD output segments of high pressure resistance and low output  
impedance, it is possible to obtain the highest driver working efficiency for the 1/200 duty panel.  
And the SED1670 can display 65 x 132 panel when used as a common driver of RAM buit-in driver, SED1531.  
FEATURES  
Number of LCD drive output segments: 100  
Common output ON resistance: 700(Typ.)  
Display duty ratio: 1/64 to 1/300 (Reference)  
Display capacity: Possible to display 640 x 480 dots when used in combination with SED 1640D or SED1606D.  
Selectable pin output shift direction  
No-bias display OFF function (*1*)  
Instantaneous display blanking enabled by inhibit function (*0*)  
Adjustable offset bias of LCD power to VDD level  
Wide range of LCD drive voltages: –7 V to –28 V (Absolute maximum rated voltage: –30 V)  
Logic system power supply: –2.7 V to –5.5 V  
Chip packaging  
SED1670D0A (Al-pad die form)  
SED1670D1A  
SED1670D0B (Au bump die form)  
SED1670D1B  
SED1670T0A (TCP die form)  
SED1670T1A  
* Under Planning  
* Under Planning  
No radial rays countermeasure taken in designing  
1

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