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Datasheet > SEAM-50-06.5-L-10-1-A-K-TR
SEAM-50-06.5-L-10-1-A-K-TR PDF预览

SEAM-50-06.5-L-10-1-A-K-TR

更新时间： 2024-11-29 19:21:15
品牌 Logo 应用领域
申泰 - SAMTEC 连接器
页数 文件大小 规格书
1页 355K
描述
Board Stacking Connector

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SEAM-50-06.5-L-10-1-A-K-TR 技术参数

是否Rohs认证： 不符合生命周期：Active
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8536.69.40.40Factory Lead Time：3 weeks
风险等级：5.77Samacsys Description：500 Position, .050 " SEARAY ™ High-Speed High-Density Open-Pin-Field Array Terminal
连接器类型：BOARD STACKING CONNECTOR联系完成终止：Tin (Sn) - with Nickel (Ni) barrier
JESD-609代码：e3Base Number Matches：1

SEAM-50-06.5-L-10-1-A-K-TR 数据手册

  
F-215 (Rev 10JUL15)  
SEAM–20–02.0–S–10–2–A–K–TR  
SEAM–30–02.0–S–08–2–A–K–TR  
SEAM–30–03.5–S–04–2–A–K–TR  
(1.27 mm) .050"  
SEAM SERIES  
HIGH SPEED/HIGH DENSITY OPEN PIN FIELD  
Up to 500  
Pins  
(1.15 mm)  
5, 8 and 10 row footprint  
.045"  
NOMINAL  
WIPE  
compatible with SamArray®.  
Samples recommended.  
Mates with:  
SEAF, SEAFP  
SPECIFICATIONS  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?SEAM  
Note: Patented  
Note: Some sizes,  
styles and options are  
non-standard, non-returnable.  
Insulator Material:  
Black LCP  
Solder  
charges  
Contact Material:  
Copper Alloy  
Operating Temp Range:  
-55°C to +125°C  
Current Rating  
Low  
insertion/  
extraction  
forces  
(7 mm stack height):  
1.8 A per pin  
(10 adjacent pins powered)  
Plating:  
Au or Sn over  
50 µ" (1.27 µm) Ni  
Contact Resistance: 5.5 mΩ  
Working Voltage: 240 VAC  
RoHS Compliant: Yes  
Lead-Free Solderable: Yes  
Rated @ 3dB Insertion Loss  
w/o PCB effects*  
SEAM/SEAF  
10 mm Stack Height  
Single-Ended Signaling  
Differential Pair Signaling  
18 GHz / 36 Gbps  
18 GHz / 36 Gbps  
*Test board losses de-embedded from performance data.  
RECOGNITIONS  
Performance data for other stack heights and complete test data  
available at www.samtec.com?SEAM or contact sig@samtec.com  
For complete scope of  
recognitions see  
www.samtec.com/quality  
NO. PINS  
PER ROW  
LEAD  
STYLE  
PLATING  
OPTION  
NO. OF  
ROWS  
SOLDER  
TYPE  
SEAM  
A
K
TR  
Specify  
LEAD  
STYLE  
from  
–L  
(0.25 µm)  
Gold on  
contact area,  
Matte Tin on  
solder tail  
–A  
= 10 µ"  
= Alignment Pins  
(Required. Arrays  
will not self-center  
on solder pads)  
–1  
–04  
=Four Rows  
(–06.5 not  
available)  
–10, –15, –20,  
= Tin/Lead Alloy  
Solder Charge  
–30, –40, –50  
(–10 only available in 04 row)  
(–15 only available in 10 row)  
chart  
–2  
–K  
= Lead-Free  
Solder Charge  
–05  
= Polyimide film  
Pick & Place Pad  
=Five Rows  
(–06.5 not  
available)  
–S  
NO. OF  
ROWS  
–04  
–05, –06  
–08  
B
= 30 µ"  
(0.76 µm)  
Gold on  
contact area,  
Matte Tin on  
solder tail  
(7.06) .278  
(9.60) .378  
(12.14) .478  
(14.68) .578  
–TR  
=Tape & Reel  
–06  
=Six Rows  
(–06.5 not  
available)  
–10  
01  
–08  
=Eight Rows  
DIFFERENTIAL  
(1.27)  
.050  
(1.27) .050  
B
PAIR  
COUNT  
–10  
ARRAY  
=Ten Rows  
(1.27)  
.050  
40x8  
40x6  
30x10  
30x8  
30x6  
20x10  
20x8  
20x5  
80  
60  
75  
60  
45  
50  
40  
25  
08  
LEAD  
A
No. of positions x (1.27) .050 + (4.98) .196  
MATED HEIGHTS  
STYLE  
–02.0  
–03.0  
–03.5  
–06.5  
–07.0  
–09.0  
–11.0  
(1.02)  
.040  
PAIR  
SEAM SEAF LEAD STYLE  
(4.60) .181  
(5.59) .220  
(6.10) .240  
(9.14) .360  
(9.60) .378  
(11.60) .457  
(13.60) .535  
ARRAY  
LEAD  
COUNT  
–05.0 –06.0 –06.5  
STYLE  
125  
100  
100  
50x10  
50x8  
40x10  
(1.27)  
.050  
(1.02)  
.040  
7 mm  
8 mm  
8 mm 8.5 mm  
9 mm 9.5 mm  
–02.0  
–03.0  
–03.5  
–06.5  
–07.0  
–09.0  
–11.0  
A
8.5 mm 9.5 mm 10 mm  
11.5 mm 12.5 mm 13 mm  
12 mm 13 mm 13.5 mm  
14 mm 15 mm 15.5 mm  
16 mm 17 mm 17.5 mm  
(0.86)  
(1.12)  
(1.27)  
.050  
.034  
DIA  
(0.10)  
.004  
.044  
DIA  
No. of positions x (1.27) .050 + (3.58) .141  
WWW.SAMTEC.COM  
Due to technical progress, all designs, specifications and components are subject to change without notice.  
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